# Applied Microsystems Studies and Concepts

**R-2A activity** of project MSL-02 — DISRUPTIVE MICROTECHNOLOGIES  
**Program element:** 0602025E — Making, Maintaining, Supply CHAIN AND Logistics  
**Component:** Defense-Wide · **Budget Activity:** 2  
**Vintage:** President's Budget PB2027  
**Canonical URL:** https://hitchintel.com/programs/0602025E/MSL-02/a23  
**Parent:** https://hitchintel.com/programs/0602025E/MSL-02

## Summary

This activity requests $30.4M in FY2027, 8.3% of project MSL-02, up 54% on FY2026. The R-2A exhibit describes it across FY2026–FY2027, including what the FY2027 money is planned to buy.

## What the FY2027 request buys

**FY2027 planned work.** - Perform evaluation of novel design techniques for advanced circuits and modules with next generation capabilities. - Initiate a trade study on new hardware architectures that can leverage commercial scaling while preserving their security and lead to superior systems. - Evaluate technologies for the control of advanced materials down to atomic levels. - Perform analysis of application benefits due to advanced microsystems design, architectures, and materials.

**FY2026 to FY2027 change.** The FY 2027 increase reflects studies and concepts initiations including, but not limited to, applied research in design techniques for next generation capabilities, and the evaluation of technologies for the control of advanced materials.

## Before the request year

**FY2026 plans — current year.** - Evaluate options for advanced material development. - Investigate potentially advantages hardware architectures for relevant applications. - Initiate analysis of application benefits due to advanced microsystems design, architectures, and materials.

## Funding

| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2026 | Enacted | 19.7 |
| FY2027 | Request | 30.4 |

> Prior, current and budget year only — an R-2A activity carries no five-year plan. It sums exactly into its project in the request year and not necessarily in any other.

## Other activities in project MSL-02

- [Disruptive Microtechnologies Studies and Concepts](https://hitchintel.com/programs/0602025E/MSL-02/a22) — FY2027 45.6
- [Digital RF Battlespace Emulator (DRBE)](https://hitchintel.com/programs/0602025E/MSL-02/a4) — FY2027 29.2
- [Crystal Palace](https://hitchintel.com/programs/0602025E/MSL-02/a18) — FY2027 27.1
- [Next Generation Microelectronics Manufacturing (NGMM)](https://hitchintel.com/programs/0602025E/MSL-02/a1) — FY2027 25.0
- [Optimum Processing Technology Inside Memory Arrays (OPTIMA)](https://hitchintel.com/programs/0602025E/MSL-02/a6) — FY2027 21.1
- Photonic Integrated Circuit Architectures for Scalable System Objectives (PICASSO) — FY2027 18.5
- Promethean Clay — FY2027 18.1
- [Smash](https://hitchintel.com/programs/0602025E/MSL-02/a20) — FY2027 17.6
- PROtein SEquencing (PROSE) — FY2027 17.4
- [Optomechanical Thermal Imaging (OpTIm)](https://hitchintel.com/programs/0602025E/MSL-02/a3) — FY2027 17.0
- [Technologies for Heat Removal in Electronics At the Device Scale (THREADS)](https://hitchintel.com/programs/0602025E/MSL-02/a5) — FY2027 14.1
- [Machine Learning and Optimization-guided Compilers for Heterogeneous Architectures (MOCHA)](https://hitchintel.com/programs/0602025E/MSL-02/a10) — FY2027 13.1
- [Advanced Sources for Single-event Effect Radiation Testing (ASSERT)](https://hitchintel.com/programs/0602025E/MSL-02/a9) — FY2027 11.9
- Faithful Integration Reverse-engineering and Emulation (FIRE) — FY2027 11.8
- Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) — FY2027 9.8
- Ultra-Wide BandGap Semiconductors (UWBGS) — FY2027 8.6
- Intelligent Generation of Tools for Security (INGOTS) — FY2027 8.3
- Minitherms3D — FY2027 6.3
- NanoWatt Platforms for Sensing, Analysis, and Computation (NaPSAC) — FY2027 6.1
- Material Synthesis Technologies for Universal and Diverse Integration Opportunities (M-STUDIO) — FY2027 5.0
- Intensity-Squeezed Photonic Integration for Revolutionary Detectors (INSPIRED) — FY2027 2.3
- COmpact Front-end Filters at the ElEment-level (COFFEE) — FY2027 2.0
- High Operational Temperature Sensors (HOTS) — FY2027 2.0
- ELectronics for G-band ARrays (ELGAR) — FY2027 —
- Space Power Conversion Electronics (SPCE) — FY2027 —
- Additive Manufacturing of MicrosystEms (AMME) — FY2027 —
- Lasers for Universal Microscale Optical Systems (LUMOS) — FY2027 —
- Scalable On-Array Processing (SOAP) — FY2027 —

## Source & machine access

- **Source:** FY2027 Office of the Secretary of Defense RDT&E Budget Justification, Exhibit R-2A, PE 0602025E project MSL-02 (PB PB2027). Narrative is the government's own text.
- **No marks, no contractors at this grain** — congressional marks land on the program element and R-3 performers on the project.
- **MCP:** `mcp.hitchintel.com` — `budget_get_activity`.

*HitchAI is an independent intelligence service, not affiliated with the U.S. Department of Defense. Budget figures are requests/estimates, not obligations.*