R-2A Activity · President's Budget PB2027

Technologies for Heat Removal in Electronics At the Device Scale (THREADS)

FY2027 Request
$14.1M
▲ 2.2% vs FY2026
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This activity requests $14.1M in FY2027, 3.8% of project MSL-02, up 2.2% on FY2026. The R-2A exhibit describes it across FY2026–FY2027, including what the FY2027 money is planned to buy.

FY2027 Request
$14.1M
▲ 2.2% vs FY2026
FY2026 Enacted
$13.8M
In law
Planned work

What the FY2027 request buys

Verbatim from the R-2A exhibit for project MSL-02 of PE 0602025E. This is the budget justification's own description of work that has not happened yet — the one thing no other level of the budget carries.

FY2027 planned work

- Reduce transistor thermal resistance by 8x compared to SOA, and design thermal resistance test structures to demonstrate this reduction. - Design and fabricate RF PAs with a 16X increase in output power density, compared to SOA, close to electrical limit. - Demonstrate robust operation of RF transistors and PAs with a 16X increase in output power density, compared to the SOA.

FY2026 to FY2027 change

The FY 2027 increase reflects a shift from initial development to design and fabrication.

Before the request year

FY2026: the year under way

Prior-year accomplishments and current-year plans from the same exhibit. Context for the FY2027 plan, not a series — an activity partitions its project exactly in the request year, but can under-cover it in earlier years.

FY2026 plans — current year

- Design and fabricate thermal resistance test structures with a 5X reduction in thermal resistance compared to the state-of-the-art (SOA). - Design and fabricate robust transistors and PAs with a 10X increase in output power density, compared to the SOA. - Demonstrate robust operation of RF transistors and PAs with a 10X increase in output power density.

Money

Three years, and no five-year plan

An R-2A activity publishes the prior year, the current year and the budget year. The FYDP outyears exist at project and program-element level and are deliberately absent here rather than inferred. Estimate types are colored and never summed into one figure.

013.8FY26ENACTED14.1FY27REQUEST
Enacted Request
Fiscal YearEstimate TypeAmount ($M)
FY2026Enacted13.8
FY2027Request14.1

This activity is 3.8% of project MSL-02's FY2027 request and 0.9% of PE 0602025E's. In the request year the activities under a project sum to it exactly; in the current year they under-cover it in about 9% of cases, so an activity's delta can legitimately exceed its parent's and the two must not be compared row to row.

Where this sits

29 activities in project MSL-02

Every R-2A line of this project, largest FY2027 request first. Linked where the activity has enough of its own narrative to carry a page; the rest are shown in full on the project page.

Disruptive Microtechnologies Studies and Concepts$45.6M ▲ 41%Applied Microsystems Studies and Concepts$30.4M ▲ 54%Digital RF Battlespace Emulator (DRBE)$29.2M ▲ 51%Crystal Palace$27.1M ▲ 100%Next Generation Microelectronics Manufacturing (NGMM)$25.0M flatOptimum Processing Technology Inside Memory Arrays (OPTIMA)$21.1M ▲ 35%
Photonic Integrated Circuit Architectures for Scalable System Objectives (PICASSO)$18.5M ▲ 200%
Promethean Clay$18.1M ▲ 140%
Smash$17.6M ▲ 140%
PROtein SEquencing (PROSE)$17.4M ▲ 119%
Optomechanical Thermal Imaging (OpTIm)$17.0M ▼ 22%
Technologies for Heat Removal in Electronics At the Device Scale (THREADS) — this activity$14.1M ▲ 2%
Machine Learning and Optimization-guided Compilers for Heterogeneous Architectures (MOCHA)$13.1M ▲ 17%Advanced Sources for Single-event Effect Radiation Testing (ASSERT)$11.9M ▲ 51%
Faithful Integration Reverse-engineering and Emulation (FIRE)$11.8M ▼ 40%
Heterogenous Adaptively Produced Photonic Interfaces (HAPPI)$9.8M ▼ 11%
Ultra-Wide BandGap Semiconductors (UWBGS)$8.6M ▼ 52%
Intelligent Generation of Tools for Security (INGOTS)$8.3M ▼ 25%
Minitherms3D$6.3M ▼ 45%
NanoWatt Platforms for Sensing, Analysis, and Computation (NaPSAC)$6.1M ▼ 49%
Material Synthesis Technologies for Universal and Diverse Integration Opportunities (M-STUDIO)$5.0M ▼ 37%
Intensity-Squeezed Photonic Integration for Revolutionary Detectors (INSPIRED)$2.3M ▼ 68%
COmpact Front-end Filters at the ElEment-level (COFFEE)$2.0M ▼ 55%
High Operational Temperature Sensors (HOTS)$2.0M ▼ 83%
ELectronics for G-band ARrays (ELGAR)▼ 100%
Space Power Conversion Electronics (SPCE)▼ 100%
Additive Manufacturing of MicrosystEms (AMME)▼ 100%
Lasers for Universal Microscale Optical Systems (LUMOS)▼ 100%
Scalable On-Array Processing (SOAP)▼ 100%
Source
FY2027 Office of the Secretary of Defense RDT&E Budget Justification · Exhibit R-2A · PE 0602025E, project MSL-02 (President's Budget PB2027). Congressional marks are recorded on the program element, never on an activity.
Machine access
Markdown twin /programs/0602025E/MSL-02/a5.md · MCP mcp.hitchintel.combudget_get_activity