# Microelectronics Technology Development

**R-2A activity** of project 622002 — Electronic Component Technology  
**Program element:** 0602204F — Aerospace Sensors  
**Component:** U.S. Air Force · **Budget Activity:** 2  
**Vintage:** President's Budget PB2027  
**Canonical URL:** https://hitchintel.com/programs/0602204F/622002/a1  
**Parent:** https://hitchintel.com/programs/0602204F/622002

## Summary

This activity requests $26.2M in FY2027, 63% of project 622002, down 25% on FY2026. The R-2A exhibit describes it across FY2026–FY2027, including what the FY2027 money is planned to buy.

## What the FY2027 request buys

**FY2027 planned work.** -Continue research and development on electronic devices, including efficient radio frequency power amplifiers, power conversion semiconductor technology, and extreme environment applications, with a focus on modeling, characterization, evaluation, and technology demonstrations to facilitate industry transition. -Continue advancing sensing and electronic warfare capabilities by enhancing simultaneous functions, utilizing open architecture for rapid updates, and minimizing size, weight, and power through robust filtering for operation in contested electromagnetic spectrum, while prototyping hardware/software digital emulation, novel sensor processing, digital-at-every-element technology for multifunction microwave and millimeter wave arrays; and, digital beamformer technology for Group 4 uncrewed and attritable aircraft weapon systems. -Continue strengthening resilient radio frequency sensor microelectronics through research and development of assured prototypes by actively assessing threats, improving circuit reliability, validating security, preventing reverse engineering, and utilizing digital engineering; continue effort to build low-power navigation and timing application-specific integrated circuit (ASIC) by developing assurance techniques in the microelectronic design process. -Commence research and development of faster, cheaper, and higher-performing microelectronic solutions for size, weight, and power-constrained platforms by developing advanced heterogeneous integration technologies that combine disparate electronic and photonic elements; enabling the development of chip-scale wideband transceiver components with integrated advanced component and thermal management technologies for cost, size, weight, and power-constrained millimeter wave applications.

**FY2026 to FY2027 change.** FY 2027 decreased compared to FY 2026 by $8.734 million due to a reduction in the development of microelectronics heterogeneous integration technologies. This reduction is the result of a strategic realignment of the Department of the Air Force's Science and Technology (DAF S&T) portfolio, which aims to optimize core research areas and improve resource efficiency.

## Before the request year

**FY2026 plans — current year.** - Continue modeling and technology development of electronic devices efforts in efficient radio frequency power amplifiers, efficient power conversion semiconductor technology, the characterization and evaluation of radio frequency and power semiconductor components, and technology demonstrations to facilitate transition to industry. Initiate research and development on electronic devices for extreme environments. - Continue development of chip-scale photonic/electronic wideband transceiver components with integrated advanced component and thermal management technologies for cost, size, weight and power constrained microwave and millimeter wave applications. - Continue research and development of resilient and assured radio frequency sensor sub-system prototypes incorporating hardware/software digital emulation, novel sensor processing, digital at every element technology for multifunction microwave and millimeter wave arrays, and digital beamformer technology advancements suitable for Group 4 uncrewed and attritable aircraft weapon systems. - Continue research and development of resilient and assured radio frequency sensor microelectronics prototypes by assessing modern threat capability, conducting reliability of complex integrated circuits, verifying and validating security techniques and methodologies for integrated circuit design, protecting critical microelectronics hardware against reverse engineering and exploitation, and applying digital engineering and virtual prototyping to develop resilience and assurance techniques for microelectronic designs.

## Funding

| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 8.0 |
| FY2026 | Enacted | 35.0 |
| FY2027 | Request | 26.2 |

> Prior, current and budget year only — an R-2A activity carries no five-year plan. It sums exactly into its project in the request year and not necessarily in any other.

## Other activities in project 622002

- [Photonics Technology Development](https://hitchintel.com/programs/0602204F/622002/a2) — FY2027 15.6
- Sensor Subsystems — FY2027 0.0
- Trusted and Assured Electronics — FY2027 0.0
- Advanced Highly Integrated Microsystems for Intelligence, Surveillance, Reconnaissance and Electronic Warfare — FY2027 0.0

## Source & machine access

- **Source:** FY2027 Department of the Air Force RDT&E Budget Justification, Exhibit R-2A, PE 0602204F project 622002 (PB PB2027). Narrative is the government's own text.
- **No marks, no contractors at this grain** — congressional marks land on the program element and R-3 performers on the project.
- **MCP:** `mcp.hitchintel.com` — `budget_get_activity`.

*HitchAI is an independent intelligence service, not affiliated with the U.S. Department of Defense. Budget figures are requests/estimates, not obligations.*