# Microelectronics Commons - 0403D — Program Element 0602669D8Z

**Program element:** 0602669D8Z  
**Component:** Defense-Wide  
**Appropriation:** 0403D — RDT&E, Defense-Wide  
**Budget Activity:** 2 — Applied Research  
**Vintage:** President's Budget PB2027  
**Canonical URL:** https://hitchintel.com/programs/0602669D8Z

## Summary

Defense-Wide requests $73.0M in FY2027 (down from a FY2026 peak), with nothing planned by FY2031. In the FY2027 defense authorization, the Senate added 69% (to $50.0M).

## Funding profile

| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 0.0 |
| FY2026 | Enacted | 79.7 |
| FY2027 | Request | 73.0 |
| FY2028 | Outyear | 0.0 |
| FY2029 | Outyear | 0.0 |
| FY2030 | Outyear | 0.0 |
| FY2031 | Outyear | 0.0 |

> Estimate types are not summed — the profile mixes actuals, enacted law, the request, and outyear projections.

## Congressional marks (FY2027)

| Stage | Marked ($M) | Change ($M) |
|---|---|---|
| Request | 73.0 | — |
| Senate NDAA (SASC) | 50.0 | +50.0 |

> FY2027 NDAA authorization marks, as of 2026-07-27. Not appropriations or final law.

## Projects (1)

| Project | Title | FY2025 actual | FY2026 enacted | FY2027 request | Move |
|---|---|---|---|---|---|
| 825 | Microelectronics Research Maturation-Development | — | 79.7 | 73.0 | −8% |

> Projects are the summable leaves: the program element total is their sum, never added to it.

### Project 825 — Microelectronics Research Maturation-Development

This project focuses on the applied research activities of the Commons including the early research and development of new microelectronics materials, processes, devices, and architectural designs. It seeks to answer how new models, science, and technology can be leveraged to create a different manufacturing paradigm based on proven process tools in agile microelectronics fabrication facilities (fabs). The project also supports the establishment of the Commons Hubs, which will be networks of regional capabilities organized in collaboration with the Commons Consortium Manager (CM) to address DoW and commercial needs and requirements. The Hubs may include existing facilities augmented to enhance intrinsic specializations in emerging areas of microelectronics. Each Hub will concentrate on one of six technical areas including: Secure Edge Computing, 5G/6G Technology, Artificial Intelligence Hardware, Quantum Technology, Electromagnetic Warfare, and Commercial Leap Ahead Technologies. Core Facilities (i.e., fabs) are integral parts of the Hubs network that will provide key fabrication capabilities that are required to demonstrate prototypes with the volume and characteristics required to ensure reduced risk for full manufacturing production. Additionally, the project will directly support early workforce development activities through the Commons network. Activities may span K-12, undergraduate, graduate and continuing education and may include, for example, establishment of PhD internships and post-doc training at Hub facilities and internships with Hub members.

| Activity (R-2A) | FY2025 | FY2026 | FY2027 |
|---|---|---|---|
| Microelectronics Research Maturation – Development | — | 79.7 | 73.0 |

> R-2A activities carry the prior, current and budget year only — no five-year plan. Coverage is partial, so count them, never total them.

## Mission & acquisition strategy

This Program supports the Department's initiatives to Build Sustainable and Long-Term Advantage, Defend the Homeland, and Deter Aggression. The Office of the Under Secretary of War for Research and Engineering (OUSW(R&E)) is executing the Microelectronics Commons (the Commons) activity pursuant to the Fiscal Year (FY) 2021 National Defense Authorization Act (NDAA) (Pub. L. 116-283), including and funded through the CHIPS for America Defense Fund established by the CHIPS Act of 2022. The FY 2021 NDAA legislation significantly emphasizes solutions that promote the domestic on-shoring of capabilities to address economic and technology security concerns. Under FY 2021 NDAA Sec.

## Related program elements

- [0603669D8Z — Microelectronics Commons - 0403D](https://hitchintel.com/programs/0603669D8Z) (Defense-Wide)
- [0604669D8Z — Microelectronics Commons - 0403D](https://hitchintel.com/programs/0604669D8Z) (Defense-Wide)
- [0605296F — Microelectronics Secure Enclave](https://hitchintel.com/programs/0605296F) (Air Force)
- [0603790F — Nato Coop R&D](https://hitchintel.com/programs/0603790F) (Air Force)

## Source & machine access

- **Source:** FY2027 Office of the Secretary of Defense RDT&E Budget Justification, Exhibits R-2/R-3, PE 0602669D8Z (PB PB2027); FY2027 NDAA committee marks (as of 2026-07-27).
- **MCP:** `mcp.hitchintel.com` — `budget_get_program_element(pe="0602669D8Z")`.

*HitchAI is an independent intelligence service, not affiliated with the U.S. Department of Defense. Budget figures are requests/estimates, not obligations.*