# Electronics Technology — Program Element 0602716E

**Program element:** 0602716E  
**Component:** Defense-Wide  
**Appropriation:** 0400 — RDT&E, Defense-Wide  
**Budget Activity:** 2 — Applied Research  
**Vintage:** President's Budget PB2027  
**Canonical URL:** https://hitchintel.com/programs/0602716E

## Summary

Defense-Wide requests $0.0M in FY2027.

## Funding profile

| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 621.1 |
| FY2026 | Enacted | 0.0 |
| FY2027 | Request | 0.0 |
| FY2028 | Outyear | 0.0 |
| FY2029 | Outyear | 0.0 |
| FY2030 | Outyear | 0.0 |
| FY2031 | Outyear | 0.0 |

> Estimate types are not summed — the profile mixes actuals, enacted law, the request, and outyear projections.

## Projects (2)

| Project | Title | FY2025 actual | FY2026 enacted | FY2027 request | Move |
|---|---|---|---|---|---|
| ELT-01 | ELECTRONIC TECHNOLOGY | 100.4 | 0.0 | 0.0 | — |
| ELT-02 | BEYOND SCALING TECHNOLOGY | 520.7 | 0.0 | 0.0 | — |

> Projects are the summable leaves: the program element total is their sum, never added to it.

### Project ELT-01 — ELECTRONIC TECHNOLOGY

Advances in microelectronic device technologies continue to significantly benefit improved weapons effectiveness, intelligence capabilities, and information superiority. The Electronic Technology project supports continued advancement in microelectronics, including electronic and optoelectronic devices, Microelectromechanical Systems (MEMS), semiconductor device design and fabrication, and new materials and material structures. Areas of particular emphasis of this work include reducing the barriers to designing and fabricating custom electronics and exploiting improved manufacturing techniques to provide low-cost, high-performance sensors. Programs in this project will also greatly improve the size, weight, power, and performance characteristics of electronic systems; support positioning, navigation, and timing in GPS-denied environments; and develop sensors more sensitive and robust than today's standards. This project has six major focus areas: Electronics, Photonics, Microelectromechanical Systems, Architectures, Algorithms, and other Electronic Technology research. Beginning in FY 2026, efforts in this Project will be funded in PEs 0602025E, Project MSL-03 and 0602026E, Project EFF-01.

| Activity (R-2A) | FY2025 | FY2026 | FY2027 |
|---|---|---|---|
| Humboldt | 10.0 | — | — |
| Scalable Analog Neural networks (ScAN) | 9.0 | — | — |
| Highly Accelerated Learnings of Vibratory Systems (HALOVS) | 14.0 | — | — |
| Sync | 10.0 | — | — |
| Microsystem Induced CAtalysis (MICA) | 15.0 | — | — |
| Emon | 6.0 | — | — |
| Robust Quantum Sensors (RoQS) | 15.0 | — | — |
| Waveform Agile Radio-frequency Directed Energy (WARDEN) | 8.4 | — | — |
| Fast Event-based Neuromorphic Camera and Electronics (FENCE) | 6.0 | — | — |
| Generating RF with Photonics for low Noise (GRYPHON) | 5.0 | — | — |
| Quantum Imaging of Vector Electromagnetic Radiation (QuIVER) | 2.0 | — | — |

> R-2A activities carry the prior, current and budget year only — no five-year plan. Coverage is partial, so count them, never total them.

### Project ELT-02 — BEYOND SCALING TECHNOLOGY

The Beyond Scaling Technology project pursues electronics performance advancements that exploit new concepts in circuit specialization and three-dimensional heterogeneous integration (3DHI) by the optimization of materials, devices, architectures, and designs to achieve specific circuit function at high performance. Because electronics advancements must simultaneously make progress in performance and secure the foundation on which our microelectronics infrastructure relies, this envisioned specialization will require incorporation of security safeguards and advancing manufacturing tools and process automation. Accordingly, programs within the Beyond Scaling Technology project will reduce barriers to making specialized circuits in today's silicon hardware and 3DHI by improving producibility. This will significantly increase the ease with which DoW can design, deliver, and eventually upgrade critical, customized microelectronics, particularly for operation in extreme environments. Programs also explore alternatives to traditional circuit architectures, for instance by exploiting 3DHI to optimize electronic devices and by incorporating novel materials and new techniques for securing DoW and commercial data and hardware. Beginning in FY 2026, efforts in this Project will be funded in PE 0602025E, Projects MQB-01 and MSL-02.

| Activity (R-2A) | FY2025 | FY2026 | FY2027 |
|---|---|---|---|
| Faithful Integration Reverse-engineering and Emulation (FIRE) | 27.0 | — | — |
| Macaroni | 22.0 | — | — |
| Additive Manufacturing of MicrosystEms (AMME) | 15.0 | — | — |
| Space Power Conversion Electronics (SPCE) | 19.0 | — | — |
| Intensity-Squeezed Photonic Integration for Revolutionary Detectors (INSPIRED) | 18.5 | — | — |
| Technologies for Heat Removal in Electronics At the Device Scale (THREADS) | 18.0 | — | — |
| Minitherms3D | 18.0 | — | — |
| High Operational Temperature Sensors (HOTS) | 18.0 | — | — |
| Optimum Processing Technology Inside Memory Arrays (OPTIMA) | 16.5 | — | — |
| Optomechanical Thermal Imaging (OpTIm) | 9.0 | — | — |
| Scalable On-Array Processing (SOAP) | 15.0 | — | — |
| Intelligent Generation of Tools for Security (INGOTS) | 13.0 | — | — |
| COmpact Front-end Filters at the ElEment-level (COFFEE) | 14.0 | — | — |
| Digital RF Battlespace Emulator (DRBE) | 14.0 | — | — |
| Advanced Sources for Single-event Effect Radiation Testing (ASSERT) | 14.0 | — | — |
| ELectronics for G-band ARrays (ELGAR) | 13.0 | — | — |
| H6 | 12.0 | — | — |
| NanoWatt Platforms for Sensing, Analysis, and Computation (NaPSAC) | 10.0 | — | — |
| Ultra-Wide BandGap Semiconductors (UWBGS) | 27.0 | — | — |
| Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) | 15.0 | — | — |
| Machine Learning and Optimization-guided Compilers for Heterogeneous Architectures (MOCHA) | 10.0 | — | — |
| Material Synthesis Technologies for Universal and Diverse Integration Opportunities (M-STUDIO) | 13.0 | — | — |
| Quantum Augmented Network (QuANET) | 14.0 | — | — |
| Lasers for Universal Microscale Optical Systems (LUMOS) | 9.0 | — | — |
| Quantum Inspired Classical Computing (QuICC) | 6.8 | — | — |
| Data Privacy in Virtual Environments (DPRIVE) | 5.0 | — | — |

> R-2A activities carry the prior, current and budget year only — no five-year plan. Coverage is partial, so count them, never total them.

## Mission & acquisition strategy

The efforts described in this Program Element (PE) address the Applied Research associated with the Electronics Technology Program that is directed towards developing electronics that make a wide range of military applications possible. The PE focuses on turning basic advancements into the underpinning technologies required to address critical national security issues and to enable an information-driven warfighter. This PE also supports innovation and robust transition planning in the technology cycle by working with entrepreneurs to increase the likelihood that DARPA funded technologies take root in the U.S. and provide new capabilities for national defense.

## Related program elements

- [0602024E — Warfighting Performance](https://hitchintel.com/programs/0602024E) (Defense-Wide)
- [0602715E — Materials AND Biological Technology](https://hitchintel.com/programs/0602715E) (Defense-Wide)
- [0207134F — F-15E Squadrons](https://hitchintel.com/programs/0207134F) (Air Force)
- [1203164SF — Military Global Positioning System USER EQUIP](https://hitchintel.com/programs/1203164SF) (Space Force)

## Source & machine access

- **Source:** FY2027 Office of the Secretary of Defense RDT&E Budget Justification, Exhibits R-2/R-3, PE 0602716E (PB PB2027).
- **MCP:** `mcp.hitchintel.com` — `budget_get_program_element(pe="0602716E")`.

*HitchAI is an independent intelligence service, not affiliated with the U.S. Department of Defense. Budget figures are requests/estimates, not obligations.*