# Project AET-02 — ADVANCED DISRUPTIVE MICROTECHNOLOGIES

**Program element:** 0603469E — Advanced Enabling Technologies  
**Project:** AET-02  
**Component:** Defense-Wide  
**Appropriation:** 0400 — RDT&E, Defense-Wide  
**Budget Activity:** 3 — Advanced Technology Development  
**Vintage:** President's Budget PB2027  
**Canonical URL:** https://hitchintel.com/programs/0603469E/AET-02  
**Parent:** https://hitchintel.com/programs/0603469E

## Summary

Project AET-02 — ADVANCED DISRUPTIVE MICROTECHNOLOGIES requests $212.5M in FY2027, 64% of the $331.0M requested for program element 0603469E, up 0.1% on FY2026. 4 R-2A activities decompose the request.

## Funding profile

| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 0.0 |
| FY2026 | Enacted | 212.4 |
| FY2027 | Request | 212.5 |
| FY2028 | Outyear | 229.0 |
| FY2029 | Outyear | 237.1 |
| FY2030 | Outyear | 238.5 |
| FY2031 | Outyear | 238.5 |

> Estimate types are not summed. This project is one leaf of PE 0603469E; the PE total is the sum of its projects, never added to them.

## What project AET-02 buys

The Advanced Disruptive Microtechnologies project supports activities to enable and accelerate the transition of advanced microsystems advancement, including those developed under the Disruptive Microtechnologies Sciences (EMR-02) and Disruptive Microtechnologies (MSL-02) projects. Funding under this project will include quantum circuits for computation and sensing; integrated photonic-electronic components for timing and data transfer; and developing new technologies and capabilities that intelligently leverage commercial scaling while still preserving advanced capabilities for the warfighter. Prior to FY 2026, efforts in this Project were funded in PE 0603739E, Projects MT-15 and MT-16.

## Activities (R-2A) — 4

| Activity | FY2025 | FY2026 | FY2027 | Move | Page |
|---|---|---|---|---|---|
| Next Generation Microelectronics Manufacturing (NGMM) | — | 175.0 | 175.0 | +0% | [a0](https://hitchintel.com/programs/0603469E/AET-02/a0) |
| Advanced Disruptive Microtechnologies Studies and Concepts | — | 10.6 | 22.7 | +114% | [a3](https://hitchintel.com/programs/0603469E/AET-02/a3) |
| Modular Efficient Laser Technology (MELT) | — | 13.0 | 7.4 | −43% | — |
| Continuous-correctness On Opaque Processors (COOP) | — | 13.8 | 7.4 | −47% | — |

> Activities carry the prior, current and budget year only — no five-year plan. In the request year they partition this project exactly; in earlier years they can under-cover it.

### Next Generation Microelectronics Manufacturing (NGMM)

- Update self-sufficiency plans based on projections from members and customer outreach. - Update roadmap with revised assessment of technical and business capabilities. - Improve yield of 3DHI fabrication process modules, including thermocompression bonding, hybrid bonding, and metal patterning. - Establish capability for processing…

Full year-by-year narrative: https://hitchintel.com/programs/0603469E/AET-02/a0

### Advanced Disruptive Microtechnologies Studies and Concepts

- Perform relevant activities related to accelerating the transition of quantum technologies. - Initiate design of photonic-electronic components for timing and data transfer for relevant use cases. - Initiate activities related to intelligently leveraging commercial scaling to provide advanced capabilities for the warfighter.

Full year-by-year narrative: https://hitchintel.com/programs/0603469E/AET-02/a3

### Modular Efficient Laser Technology (MELT)

**FY2027 planned work.** - Fabricate integrated laser tiles with optical amplifiers, phase control, and thermal management. - Integrate laser tiles into panelized high energy laser (HEL) array with high power and high efficiency. - Demonstrate a fully integrated HEL array.

**FY2026 to FY2027 change.** The FY 2027 decrease reflects a shift from finalizing fabrication and assembly to demonstration of fully integrated laser tile.

**FY2026 plans — current year.** - Fabricate full laser tile array of semiconductor amplifiers with good electrical-to-optical efficiency. - Integrate full laser tiles with semiconductor amplifiers, phase sensing and control, and power and thermal management. - Demonstrate a fully integrated laser tile, including a full array beam combination test to show traceability to integration in a panelized array with minimal degradation in beam quality.

### Continuous-correctness On Opaque Processors (COOP)

**FY2027 planned work.** - Demonstrate proof-of-concept solutions in a real-world scenario. - Generalize the techniques to multiple different processors.

**FY2026 to FY2027 change.** The FY 2027 decrease reflects the shift from researching a wide array of hardware and software solutions to developing and validating a small number of proof-of-concept solutions.

**FY2026 plans — current year.** - Develop proof-of-concept that errors detected can be corrected within a relevant timeframe. - Develop techniques to minimize overhead during error detection. - Validate proof-of-concept solutions to correlate signatures to software errors within a relevant timeframe.

## What is NOT on this page

Congressional marks, the R-2 mission description and acquisition strategy, the industry vs government split of the whole request, and related program elements are recorded at **program-element** grain — an NDAA mark lands on a PE, never on a project. They are at https://hitchintel.com/programs/0603469E.

## Source & machine access

- **Source:** FY2027 Office of the Secretary of Defense RDT&E Budget Justification, Exhibits R-2/R-2A/R-3, PE 0603469E project AET-02 (PB PB2027).
- **MCP:** `mcp.hitchintel.com` — `budget_get_program_element(pe="0603469E")`.

*HitchAI is an independent intelligence service, not affiliated with the U.S. Department of Defense. Budget figures are requests/estimates, not obligations.*