# Next Generation Microelectronics Manufacturing (NGMM)

**R-2A activity** of project AET-02 — ADVANCED DISRUPTIVE MICROTECHNOLOGIES  
**Program element:** 0603469E — Advanced Enabling Technologies  
**Component:** Defense-Wide · **Budget Activity:** 3  
**Vintage:** President's Budget PB2027  
**Canonical URL:** https://hitchintel.com/programs/0603469E/AET-02/a0  
**Parent:** https://hitchintel.com/programs/0603469E/AET-02

## Summary

This activity requests $175.0M in FY2027, 82% of project AET-02, up 0.0% on FY2026. The R-2A exhibit describes it across FY2026–FY2027, including what the FY2027 money is planned to buy.

## What the FY2027 request buys

**FY2027 planned work.** - Update self-sufficiency plans based on projections from members and customer outreach. - Update roadmap with revised assessment of technical and business capabilities. - Improve yield of 3DHI fabrication process modules, including thermocompression bonding, hybrid bonding, and metal patterning. - Establish capability for processing non-silicon material substrates on standard silicon processing equipment. - Develop advanced thermal management solutions for integration in 3DHI assemblies. - Demonstrate user portal for external users to access 3D-ADK and purchase design and prototyping services.

## Before the request year

**FY2026 plans — current year.** - Develop baseline plan for user access model that addresses membership structure and intellectual property management. - Complete design review of 3DHI process and test vehicles. - Develop and optimize 3DHI fabrication process modules, including thermocompression bonding, hybrid bonding, and metal patterning. - Demonstrate baseline 3DHI test vehicles, including a power amplifier, low noise amplifier, and interposer. - Update design for test, design for manufacturing/yield, and design for reliability standards.

## Funding

| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2026 | Enacted | 175.0 |
| FY2027 | Request | 175.0 |

> Prior, current and budget year only — an R-2A activity carries no five-year plan. It sums exactly into its project in the request year and not necessarily in any other.

## Other activities in project AET-02

- [Advanced Disruptive Microtechnologies Studies and Concepts](https://hitchintel.com/programs/0603469E/AET-02/a3) — FY2027 22.7
- Modular Efficient Laser Technology (MELT) — FY2027 7.4
- Continuous-correctness On Opaque Processors (COOP) — FY2027 7.4

## Source & machine access

- **Source:** FY2027 Office of the Secretary of Defense RDT&E Budget Justification, Exhibit R-2A, PE 0603469E project AET-02 (PB PB2027). Narrative is the government's own text.
- **No marks, no contractors at this grain** — congressional marks land on the program element and R-3 performers on the project.
- **MCP:** `mcp.hitchintel.com` — `budget_get_activity`.

*HitchAI is an independent intelligence service, not affiliated with the U.S. Department of Defense. Budget figures are requests/estimates, not obligations.*