# Microelectronics Commons - 0403D — Program Element 0603669D8Z

**Program element:** 0603669D8Z  
**Component:** Defense-Wide  
**Appropriation:** 0403D — RDT&E, Defense-Wide  
**Budget Activity:** 3 — Advanced Technology Development  
**Vintage:** President's Budget PB2027  
**Canonical URL:** https://hitchintel.com/programs/0603669D8Z

## Summary

Defense-Wide requests $264.6M in FY2027 — the program's peak, with nothing planned by FY2031.

## Funding profile

| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 0.0 |
| FY2026 | Enacted | 260.7 |
| FY2027 | Request | 264.6 |
| FY2028 | Outyear | 0.0 |
| FY2029 | Outyear | 0.0 |
| FY2030 | Outyear | 0.0 |
| FY2031 | Outyear | 0.0 |

> Estimate types are not summed — the profile mixes actuals, enacted law, the request, and outyear projections.

## Projects (1)

| Project | Title | FY2025 actual | FY2026 enacted | FY2027 request | Move |
|---|---|---|---|---|---|
| 829 | Microelectronics Research Maturation – Prototyping | — | 260.7 | 264.6 | +2% |

> Projects are the summable leaves: the program element total is their sum, never added to it.

### Project 829 — Microelectronics Research Maturation – Prototyping

This project focuses on the advanced technology development activities of the Commons including prototyping of devices or components using new microelectronics materials, processes, device designs, and architectural designs. It will also enable the establishment and operation of a Commons Consortium Manager (CM), which will provide efficient coordination and administration of regional innovation hubs. The CM is tasked with operating the Commons network, in alignment with the OUSW(R&E) Commons vision to ensure DoW access to and benefit from resulting technologies. The project also supports the establishment of the Commons Hubs, which will be networks of regional capabilities organized in collaboration with the CM to address DoW and commercial needs and requirements. The Hubs may include existing facilities augmented to enhance intrinsic specializations in emerging areas of microelectronics. Each Hub will concentrate on one of six technical areas including: Secure Edge Computing, 5G/6G Technology, Artificial Intelligence Hardware, Quantum Technology, Electromagnetic Warfare, and Commercial Leap Ahead Technologies. Core Facilities (i.e., fabs) are integral parts of the Hubs network that will provide key fabrication capabilities that are required to demonstrate prototypes with the volume and characteristics required to ensure reduced risk for full manufacturing production. Additionally, the project will directly support early workforce development activities through the Commons network. Activities may span K-12, undergraduate, graduate and continuing education and may include, for example, establishment of PhD internships and post-doc training at Hub facilities and internships with Hub members.

| Activity (R-2A) | FY2025 | FY2026 | FY2027 |
|---|---|---|---|
| Microelectronics Research Maturation – Prototyping | 0.0 | 260.7 | 264.6 |

> R-2A activities carry the prior, current and budget year only — no five-year plan. Coverage is partial, so count them, never total them.

## Mission & acquisition strategy

This Program supports the Department's initiatives to Build Sustainable and Long-Term Advantage, Defend the Homeland, and Deter Aggression. The Office of the Under Secretary of War for Research and Engineering (OUSW(R&E)) is executing the Microelectronics Commons (the Commons) activity pursuant to the Fiscal Year (FY) 2021 National Defense Authorization Act (NDAA) (Pub. L. 116-283), including and funded through the CHIPS for America Defense Fund established by the CHIPS Act of 2022. The FY 2021 NDAA legislation significantly emphasizes solutions that promote the domestic on-shoring of capabilities to address economic and technology security concerns. Under FY 2021 NDAA Sec.

## Related program elements

- [0602669D8Z — Microelectronics Commons - 0403D](https://hitchintel.com/programs/0602669D8Z) (Defense-Wide)
- [0604669D8Z — Microelectronics Commons - 0403D](https://hitchintel.com/programs/0604669D8Z) (Defense-Wide)
- [0605296F — Microelectronics Secure Enclave](https://hitchintel.com/programs/0605296F) (Air Force)
- [0603790F — Nato Coop R&D](https://hitchintel.com/programs/0603790F) (Air Force)

## Source & machine access

- **Source:** FY2027 Office of the Secretary of Defense RDT&E Budget Justification, Exhibits R-2/R-3, PE 0603669D8Z (PB PB2027).
- **MCP:** `mcp.hitchintel.com` — `budget_get_program_element(pe="0603669D8Z")`.

*HitchAI is an independent intelligence service, not affiliated with the U.S. Department of Defense. Budget figures are requests/estimates, not obligations.*