# Photonic Foundry and Packaging Innovation

**R-2A activity** of project 350 — Manufacturing Innovation Institutes  
**Program element:** 0603680D8Z — Defense Wide Manufacturing Science and Technology Program  
**Component:** Defense-Wide · **Budget Activity:** 3  
**Vintage:** President's Budget PB2027  
**Canonical URL:** https://hitchintel.com/programs/0603680D8Z/350/a3  
**Parent:** https://hitchintel.com/programs/0603680D8Z/350

## Summary

This activity requests $11.1M in FY2027, 4.8% of project 350, down 29% on FY2026. The R-2A exhibit describes it across FY2025–FY2027, including what the FY2027 money is planned to buy.

## What the FY2027 request buys

**FY2027 planned work.** Continue to develop and offer next generation integrated photonic circuit fabrication and test, assembly, and packaging (TAP) capabilities to the U.S. ecosystem. Extend design and training opportunities to continue to grow the overall integrated photonic circuit ecosystem. Perform targeted work to explore solutions for long-haul and short-haul photonic data networks with reduced power consumption, improve the variety and performance of laser solutions, target heterogeneous integration opportunities, and expand accessibility to low-loss platforms for sensing and quantum applications.

**FY2026 to FY2027 change.** A decrease of $4.460 million from FY 2026 to FY 2027 realignment of the DoW armed services requirements being moved to Manufacturing Modernization Sprints.

## Before the request year

**FY2026 plans — current year.** Continue to develop and offer next generation integrated photonic circuit fabrication and test, assembly, and packaging (TAP) capabilities to the U.S. ecosystem. Extend design and training opportunities to continue to grow the overall integrated photonic circuit ecosystem. Perform targeted work to explore solutions for long-haul and short-haul photonic data networks with reduced power consumption, improve the variety and performance of laser solutions, target heterogeneous integration opportunities, and expand accessibility to low-loss platforms for sensing and quantum applications.

**FY2025 accomplishments.** Continue to develop and offer next generation integrated photonic circuit fabrication and test, assembly, and packaging (TAP) capabilities to the U.S. ecosystem. Extend design and training opportunities to continue to grow the overall integrated photonic circuit ecosystem. Perform targeted work to improve the variety and performance of laser solutions and expand accessibility to low-loss platforms for sensing and quantum applications.

## Funding

| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 16.5 |
| FY2026 | Enacted | 15.5 |
| FY2027 | Request | 11.1 |

> Prior, current and budget year only — an R-2A activity carries no five-year plan. It sums exactly into its project in the request year and not necessarily in any other.

## Other activities in project 350

- [Adoption of Defense Advanced Manufacturing (ADAM)](https://hitchintel.com/programs/0603680D8Z/350/a9) — FY2027 130.3
- [Manufacturing Modernization Sprints](https://hitchintel.com/programs/0603680D8Z/350/a10) — FY2027 28.0
- [Medical Cell, Tissue, and Organ Manufacturing Innovation](https://hitchintel.com/programs/0603680D8Z/350/a6) — FY2027 10.0
- Bioindustrial Manufacturing Innovation — FY2027 8.3
- Materials Innovation — FY2027 7.6
- Robotic Automation Innovation — FY2027 7.3
- Manufacturing Digital Innovation — FY2027 7.2
- Additive Manufacturing Innovation — FY2027 7.0
- Hybrid Electronics Innovation — FY2027 6.9
- Advanced Fiber and Fabric — FY2027 5.3

## Source & machine access

- **Source:** FY2027 Office of the Secretary of Defense RDT&E Budget Justification, Exhibit R-2A, PE 0603680D8Z project 350 (PB PB2027). Narrative is the government's own text.
- **No marks, no contractors at this grain** — congressional marks land on the program element and R-3 performers on the project.
- **MCP:** `mcp.hitchintel.com` — `budget_get_activity`.

*HitchAI is an independent intelligence service, not affiliated with the U.S. Department of Defense. Budget figures are requests/estimates, not obligations.*