# Advanced Electronics and Optics

**R-2A activity** of project 680 — Manufacturing Science and Technology Program  
**Program element:** 0603680D8Z — Defense Wide Manufacturing Science and Technology Program  
**Component:** Defense-Wide · **Budget Activity:** 3  
**Vintage:** President's Budget PB2027  
**Canonical URL:** https://hitchintel.com/programs/0603680D8Z/680/a0  
**Parent:** https://hitchintel.com/programs/0603680D8Z/680

## Summary

This activity requests $35.1M in FY2027, 43% of project 680, up 138% on FY2026. The R-2A exhibit describes it across FY2025–FY2027, including what the FY2027 money is planned to buy.

## What the FY2027 request buys

**FY2027 planned work.** Fund year 3 of 4 of Manufacturing Advances in the Scaling of Thin Electro-optic Resources for Making Integrated Niobate Devices (MASTERMIND), Year 2 of 3 for Fiber Laser-Attach for Manufacturability and Environmental Stability (FLAMES), Year 3 of 5 for Advanced Manufacturing of Thin Film Batteries, Year 3 of 3 for Automated Manufacturing of Small Format Liquid Reserve Batteries, Year 1 of 3 for Advanced Energy Storage System for Contested Logistics, Year 1 of 3 for High Energy Raman Lasers for Missile Defense, Year 1 of 3 for Manufacturing Infrared Arrays with Direct Bonding, Year 1 of 3 for Navigation Grade IMU for Precision Guided Munitions, and Year 1 of 4 for Superconducting MAGNAV with A-Axis Squid Arrays in HTS (SMASH). Additional funding being applied to beam steering optic components for high energy laser technologies to support directed energy applications.

**FY2026 to FY2027 change.** The increase of $20.372 million between FY 2026 and FY 2027 reflects a net increase of $15.000 million for Batteries for Key Systems for Thermal Batteries and an additional $5.372 million for a high energy laser technology initiative supporting beam steering and optical components in support of directed energy technologies is reflected as part of the year-to-year funding increase.

## Before the request year

**FY2026 plans — current year.** Fund year 5 of 5 for Transmit/Receive Integrated System on a Chip (TRISoC) and Direct-write Manufacturing for Conformal Antennas, Year 3 of 3 for Advanced Pulse Power Solutions, Year 2 of 3 for Optically Based Enhancements for Accurate Mechanical Sensors (O-Beams) and Automated Manufacturing of Small Format Liquid Reserve Batteries.

**FY2025 accomplishments.** Fund year 4 of 5 for Transmit/Receive Integrated System on a Chip (TRISoC) and Direct-Write Manufacturing for Conformal Antennas, Year 3 of 3 for CEPSIS, High Voltage Materials for Thermal Batteries, CMOS Signal for Hypersonic Platforms, BLADE, Year 2 of 2 for Focal Plane Array Output, Year 2 of 3 for Advanced Pulse Power Solutions, and Year 1 of 3 for Optically Based Enhancements for Accurate Mechanical Sensors (O-Beams) and Automated Manufacturing of Small Format Liquid Reserve Batteries.

## Funding

| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 16.8 |
| FY2026 | Enacted | 14.8 |
| FY2027 | Request | 35.1 |

> Prior, current and budget year only — an R-2A activity carries no five-year plan. It sums exactly into its project in the request year and not necessarily in any other.

## Other activities in project 680

- [Advanced Materials and Composites](https://hitchintel.com/programs/0603680D8Z/680/a1) — FY2027 36.2
- Advanced and Emerging Manufacturing Processes — FY2027 8.9
- Advanced Energetics Manufacturing — FY2027 1.4

## Source & machine access

- **Source:** FY2027 Office of the Secretary of Defense RDT&E Budget Justification, Exhibit R-2A, PE 0603680D8Z project 680 (PB PB2027). Narrative is the government's own text.
- **No marks, no contractors at this grain** — congressional marks land on the program element and R-3 performers on the project.
- **MCP:** `mcp.hitchintel.com` — `budget_get_activity`.

*HitchAI is an independent intelligence service, not affiliated with the U.S. Department of Defense. Budget figures are requests/estimates, not obligations.*