What the FY2027 request buys
Verbatim from the R-2A exhibit for project 004 of PE 0603720S. This is the budget justification's own description of work that has not happened yet — the one thing no other level of the budget carries.
DMEA will transition from capability establishment to enterprise-wide mission impact by ramping DMEA's newly established GOGO facilities to full-rate production, operationalizing those capabilities, and dedicating manufacturing capacity to high-priority national security needs. This includes increasing organic engineering support for the critical C-UAS mission, directly supporting Army Materiel Command’s SkyFoundry drone design, and expanding partnerships where DMEA serves as the sole semiconductor manufacturer for key industry collaborators. In parallel, DMEA will evolve the organic sustainment model, standardizing our TDP and training curriculum to accelerate its adoption across all Services. DMEA existing contract vehicle will be leveraged to tackle larger, multi-service acquisition challenges, while DMEA trusted access and validation pipeline will shift focus to qualifying entire classes of next-generation commercial technology, further accelerating the delivery of critical capabilities to the warfighter.
The FY 2027 increase reflects labor and non-labor adjustments necessary to support expanded engineering, manufacturing, and validation activities as DMEA ramps to full-rate production of high-voltage Silicon Carbide components. This increase enables expanded capacity to accelerate qualification and delivery of next-generation microelectronics, enhancing production throughput and supporting mission-critical directed energy and munitions requirements across the Department of War.
FY2025–FY2026: what came before
Prior-year accomplishments and current-year plans from the same exhibit. Context for the FY2027 plan, not a series — an activity partitions its project exactly in the request year, but can under-cover it in earlier years.
DMEA will capitalize on its foundational successes to scale mission impact across the Department of War. DMEA will transition from establishing capabilities to maximizing their operational output. A primary focus will be executing the contracts for the build-out of 20,000 sq. ft. of clean room and 10,000 sq. ft. of laboratory space to increase the production throughput of mission-critical components for directed energy, hypersonics, and strategic munitions programs. Building on DMEA landmark success with the USMC and Army, DMEA will also expand our hands-on training and TDP co-development model to additional Services and platforms. A key part of this effort will be to scale TDP services specifically in support of munitions component-level repair, creating a wider network of self-sufficient, depot-level capabilities throughout the DoW. DMEA will begin leveraging existing contract vehicle to address enterprise-level acquisition challenges, providing rapid, expert engineering oversight on a scale previously not possible. Finally, DMEA will accelerate the validation of commercial components for strategic use by increasing the volume and complexity of parts assessed through our Radiation Testing Facility, directly fed by an expanded list of trusted suppliers accredited through the Trusted Access Program Office (TAPO).
DMEA will design, develop, and demonstrate microelectronics concepts, advanced technologies, and applications to solve operational problems. DMEA will apply advanced technologies to add performance enhancements in response to the newest asymmetric threats and to modernize and sustain aging weapon systems. To meet the increased missions seen in the last several years by CCMDs and the Intelligence Community, DMEA will extend and refresh capability by recapitalizing and modernizing its aging laboratory infrastructure, all to meet quick turn solutions on which CCMDs and Special Operations can rely. DMEA will continue to act as the program manager for the Trusted Foundry Program and will provide the Department with access to state-of-the-art microelectronics semiconductor capabilities with the added benefit of Trust, if necessary, to meet their confidentiality, integrity, availability, performance and delivery needs via the TAPO. The program also provides the Services and other agencies with a competitive cadre of accredited Trusted suppliers that can meet the needs of their mission critical/essential systems for Trusted integrated circuit components. The TAPO has contracted with commercial sources to satisfy state-of-the-art semiconductor requirements. DMEA will foster all viable alternatives to continue the vital supply of Trusted microelectronics, including the work of the DMEA TAPO with commercial state-of-the-art industry. In areas where Trust is not available, DMEA will support the Department in semiconductor assurance pilots and frameworks as needed.
Three years, and no five-year plan
An R-2A activity publishes the prior year, the current year and the budget year. The FYDP outyears exist at project and program-element level and are deliberately absent here rather than inferred. Estimate types are colored and never summed into one figure.
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 133.1 |
| FY2026 | Enacted | 133.3 |
| FY2027 | Request | 139.9 |
This activity is 100% of project 004's FY2027 request and 100% of PE 0603720S's. In the request year the activities under a project sum to it exactly; in the current year they under-cover it in about 9% of cases, so an activity's delta can legitimately exceed its parent's and the two must not be compared row to row.
1 activity in project 004
Every R-2A line of this project, largest FY2027 request first. Linked where the activity has enough of its own narrative to carry a page; the rest are shown in full on the program-element page.