# Defense Microelectronics Activity Accomplishments/Plans

**R-2A activity** of project 004 — Defense MicroElectronics Activity (DMEA)  
**Program element:** 0603720S — Microelectronics Technology Development and Support (DMEA)  
**Component:** Defense-Wide · **Budget Activity:** 3  
**Vintage:** President's Budget PB2027  
**Canonical URL:** https://hitchintel.com/programs/0603720S/004/a0  
**Parent:** https://hitchintel.com/programs/0603720S

## Summary

This activity requests $139.9M in FY2027, 100% of project 004, up 4.9% on FY2026. The R-2A exhibit describes it across FY2025–FY2027, including what the FY2027 money is planned to buy.

## What the FY2027 request buys

**FY2027 planned work.** DMEA will transition from capability establishment to enterprise-wide mission impact by ramping DMEA's newly established GOGO facilities to full-rate production, operationalizing those capabilities, and dedicating manufacturing capacity to high-priority national security needs. This includes increasing organic engineering support for the critical C-UAS mission, directly supporting Army Materiel Command’s SkyFoundry drone design, and expanding partnerships where DMEA serves as the sole semiconductor manufacturer for key industry collaborators. In parallel, DMEA will evolve the organic sustainment model, standardizing our TDP and training curriculum to accelerate its adoption across all Services. DMEA existing contract vehicle will be leveraged to tackle larger, multi-service acquisition challenges, while DMEA trusted access and validation pipeline will shift focus to qualifying entire classes of next-generation commercial technology, further accelerating the delivery of critical capabilities to the warfighter.

**FY2026 to FY2027 change.** The FY 2027 increase reflects labor and non-labor adjustments necessary to support expanded engineering, manufacturing, and validation activities as DMEA ramps to full-rate production of high-voltage Silicon Carbide components. This increase enables expanded capacity to accelerate qualification and delivery of next-generation microelectronics, enhancing production throughput and supporting mission-critical directed energy and munitions requirements across the Department of War.

## Before the request year

**FY2026 plans — current year.** DMEA will capitalize on its foundational successes to scale mission impact across the Department of War. DMEA will transition from establishing capabilities to maximizing their operational output. A primary focus will be executing the contracts for the build-out of 20,000 sq. ft. of clean room and 10,000 sq. ft. of laboratory space to increase the production throughput of mission-critical components for directed energy, hypersonics, and strategic munitions programs. Building on DMEA landmark success with the USMC and Army, DMEA will also expand our hands-on training and TDP co-development model to additional Services and platforms. A key part of this effort will be to scale TDP services specifically in support of munitions component-level repair, creating a wider network of self-sufficient, depot-level capabilities throughout the DoW. DMEA will begin leveraging existing contract vehicle to address enterprise-level acquisition challenges, providing rapid, expert engineering oversight on a scale previously not possible. Finally, DMEA will accelerate the validation of commercial components for strategic use by increasing the volume and complexity of parts assessed through our Radiation Testing Facility, directly fed by an expanded list of trusted suppliers accredited through the Trusted Access Program Office (TAPO).

**FY2025 accomplishments.** DMEA will design, develop, and demonstrate microelectronics concepts, advanced technologies, and applications to solve operational problems. DMEA will apply advanced technologies to add performance enhancements in response to the newest asymmetric threats and to modernize and sustain aging weapon systems. To meet the increased missions seen in the last several years by CCMDs and the Intelligence Community, DMEA will extend and refresh capability by recapitalizing and modernizing its aging laboratory infrastructure, all to meet quick turn solutions on which CCMDs and Special Operations can rely. DMEA will continue to act as the program manager for the Trusted Foundry Program and will provide the Department with access to state-of-the-art microelectronics semiconductor capabilities with the added benefit of Trust, if necessary, to meet their confidentiality, integrity, availability, performance and delivery needs via the TAPO. The program also provides the Services and other agencies with a competitive cadre of accredited Trusted suppliers that can meet the needs of their mission critical/essential systems for Trusted integrated circuit components. The TAPO has contracted with commercial sources to satisfy state-of-the-art semiconductor requirements. DMEA will foster all viable alternatives to continue the vital supply of Trusted microelectronics, including the work of the DMEA TAPO with commercial state-of-the-art industry. In areas where Trust is not available, DMEA will support the Department in semiconductor assurance pilots and frameworks as needed.

## Funding

| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 133.1 |
| FY2026 | Enacted | 133.3 |
| FY2027 | Request | 139.9 |

> Prior, current and budget year only — an R-2A activity carries no five-year plan. It sums exactly into its project in the request year and not necessarily in any other.

## Source & machine access

- **Source:** FY2027 Office of the Secretary of Defense RDT&E Budget Justification, Exhibit R-2A, PE 0603720S project 004 (PB PB2027). Narrative is the government's own text.
- **No marks, no contractors at this grain** — congressional marks land on the program element and R-3 performers on the project.
- **MCP:** `mcp.hitchintel.com` — `budget_get_activity`.

*HitchAI is an independent intelligence service, not affiliated with the U.S. Department of Defense. Budget figures are requests/estimates, not obligations.*