# Advanced Electronics Technologies — Program Element 0603739E

**Program element:** 0603739E  
**Component:** Defense-Wide  
**Appropriation:** 0400 — RDT&E, Defense-Wide  
**Budget Activity:** 3 — Advanced Technology Development  
**Vintage:** President's Budget PB2027  
**Canonical URL:** https://hitchintel.com/programs/0603739E

## Summary

Defense-Wide requests $0.0M in FY2027.

## Funding profile

| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 148.4 |
| FY2026 | Enacted | 0.0 |
| FY2027 | Request | 0.0 |
| FY2028 | Outyear | 0.0 |
| FY2029 | Outyear | 0.0 |
| FY2030 | Outyear | 0.0 |
| FY2031 | Outyear | 0.0 |

> Estimate types are not summed — the profile mixes actuals, enacted law, the request, and outyear projections.

## Projects (2)

| Project | Title | FY2025 actual | FY2026 enacted | FY2027 request | Move |
|---|---|---|---|---|---|
| MT-15 | MIXED TECHNOLOGY INTEGRATION | 53.4 | 0.0 | 0.0 | — |
| MT-16 | BEYOND SCALING ADVANCED TECHNOLOGIES | 95.0 | 0.0 | 0.0 | — |

> Projects are the summable leaves: the program element total is their sum, never added to it.

### Project MT-15 — MIXED TECHNOLOGY INTEGRATION

The Mixed Technology Integration project funds the advanced development and demonstration of selected basic and applied electronics research programs. Examples of technologies with funded development and demonstration activities include, but are not limited to: reducing the size, weight, and power (SWaP) of components for laser weapon systems that will protect airborne platforms from emerging surface-to-air missiles; integrated photonic-electronic components for positioning, navigation and timing in GPS-denied environments; flexible, software-defined cameras that enable real-time image analysis of complex scenes to provide more actionable information; and optical communications systems that rely on no moving parts enabling their use on SWaP-restricted platforms. Funding under this project is intended to advance transitioning novel technologies to use, providing advanced components compatible with mid-term and other future warfighting requirements. Beginning in FY 2026, efforts in this Project will be funded in PE 0603469E, Project AET-02 and PE 0603467E, Project DAT-01.

| Activity (R-2A) | FY2025 | FY2026 | FY2027 |
|---|---|---|---|
| Modular Efficient Laser Technology (MELT) | 17.4 | — | — |
| Box Kick | 36.0 | — | — |

> R-2A activities carry the prior, current and budget year only — no five-year plan. Coverage is partial, so count them, never total them.

### Project MT-16 — BEYOND SCALING ADVANCED TECHNOLOGIES

The Beyond Scaling Advanced Technologies Project supports activities to enable and accelerate the transition of disruptive microelectronics advancement, including those developed under the Beyond Scaling Sciences (ES-02) and Beyond Scaling Technology (ELT-02) projects. Funding under this project will include developing new technologies and capabilities in commercial settings, establishing access to these new processes and to commercial state-of-the-art foundries, enabling prototyping, developing manufacturable processes for three-dimensional heterogeneous integration (including integrated photonics), advancing new architectures and integration technologies for advanced field programmable gate arrays (FPGAs), and innovating back end of line technologies for wide bandgap semiconductors. Beginning in FY 2026, efforts in this Project will be funded in PE 0603469E, Project AET-02.

| Activity (R-2A) | FY2025 | FY2026 | FY2027 |
|---|---|---|---|
| Next Generation Microelectronics Manufacturing (NGMM) | 82.5 | — | — |
| Continuous-correctness On Opaque Processors (COOP) | 12.5 | — | — |

> R-2A activities carry the prior, current and budget year only — no five-year plan. Coverage is partial, so count them, never total them.

## Mission & acquisition strategy

The efforts described in this Program Element (PE) address the Advanced Technology Development associated with the Advanced Electronics Technologies Program that seeks to design and demonstrate state-of-the-art manufacturing and processing technologies for the production of various electronics and microelectronic devices, sensor systems, integrated photonic-electronic components that have military applications and potential commercial utility. Introduction of advanced product design capability and flexible, scalable manufacturing techniques will enable the commercial sector to rapidly and cost-effectively satisfy military requirements.

## Related program elements

- [0605294D8Z — Trusted and Assured Microelectronics](https://hitchintel.com/programs/0605294D8Z) (Defense-Wide)
- [0401334F — Effector Development](https://hitchintel.com/programs/0401334F) (Air Force)
- [0605233A — Accessions Information Environment (AIE)](https://hitchintel.com/programs/0605233A) (Army)
- [0305208M — Distributed Common Ground/Surface Systems](https://hitchintel.com/programs/0305208M) (Navy)

## Source & machine access

- **Source:** FY2027 Office of the Secretary of Defense RDT&E Budget Justification, Exhibits R-2/R-3, PE 0603739E (PB PB2027).
- **MCP:** `mcp.hitchintel.com` — `budget_get_program_element(pe="0603739E")`.

*HitchAI is an independent intelligence service, not affiliated with the U.S. Department of Defense. Budget figures are requests/estimates, not obligations.*