# Trusted and Assured Microelectronics — Program Element 0604294D8Z

**Program element:** 0604294D8Z  
**Component:** Defense-Wide  
**Appropriation:** 0400 — RDT&E, Defense-Wide  
**Budget Activity:** 4 — Advanced Component Development & Prototypes  
**Vintage:** President's Budget PB2027  
**Canonical URL:** https://hitchintel.com/programs/0604294D8Z

## Summary

Defense-Wide funding falls 71% to a $156.7M request in FY2027, sustained across the five-year plan. In the FY2027 defense authorization, the House added 1.6% (to $159.2M); the Senate added 223% (to $506.7M); House appropriators added 72% (to $269.4M).

## Funding profile

| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 788.3 |
| FY2026 | Enacted | 549.2 |
| FY2027 | Request | 156.7 |
| FY2028 | Outyear | 153.9 |
| FY2029 | Outyear | 154.3 |
| FY2030 | Outyear | 151.5 |
| FY2031 | Outyear | 151.4 |

> Estimate types are not summed — the profile mixes actuals, enacted law, the request, and outyear projections.

## Congressional marks (FY2027)

| Stage | Marked ($M) | Change ($M) |
|---|---|---|
| Request | 156.7 | — |
| House NDAA (HASC) | 159.2 | +2.5 |
| Senate NDAA (SASC) | 506.7 | +350.0 |
| House Approps (HAC-D) | 269.4 | +112.7 |

> FY2027 NDAA authorization marks, as of 2026-07-27. Not appropriations or final law.

## Projects (6)

| Project | Title | FY2025 actual | FY2026 enacted | FY2027 request | Move |
|---|---|---|---|---|---|
| 911 | DOW Unique Needs RADHARD | 125.0 | 187.3 | 108.5 | −42% |
| 912 | ME U.S. ME Dominance-Dev | 140.0 | 139.5 | 25.6 | −82% |
| 907 | Access to State-of-the-Art (SOTA) Microelectronics - Development | 311.8 | 125.0 | 14.9 | −88% |
| 908 | Access to Advanced Packaging and Testing - Development | 53.0 | 97.3 | 7.7 | −92% |
| 271 | Software Assurance | 8.5 | 0.0 | 0.0 | — |
| 294 | Classified Microelectronics Project | 150.0 | 0.0 | 0.0 | — |

> Projects are the summable leaves: the program element total is their sum, never added to it.

### Project 911 — DOW Unique Needs RADHARD

The DoW relies on a small number of specialty suppliers to develop and acquire the application specific integrated circuits (ASICs) and specialized or modified commercial components required to satisfy military needs for radiation hardened digital and analog microelectronics. By partnering in the maturation of SOTA material sources, foundries, and packaging facilities, the DoW is aligning commercial practices with unique needs for performance and functionality and encouraging open access design to stimulate innovation and drive affordability. Expanding the manufacturing capability and capacity of facilities for fabrication, packaging, and testing are all enablers to ensuring availability of radiation hardened microelectronics.

| Activity (R-2A) | FY2025 | FY2026 | FY2027 |
|---|---|---|---|
| Access to Radiation Hardened-, RF-, and Opto-Electronic Development | 125.0 | 187.3 | 108.5 |

> R-2A activities carry the prior, current and budget year only — no five-year plan. Coverage is partial, so count them, never total them.

### Project 912 — ME U.S. ME Dominance-Dev

This project promotes microelectronics innovation and creates an evidence-based assured microelectronics pipeline and strategic partnerships for assuring field programmable gate array (FPGA) devices, supply chain awareness and security, and workforce development. It will strengthen workforce expertise and ensure DoW has access to the next generation of advanced technology by utilizing an evidence-based assurance approach. This approach enables management of microelectronics security that is commensurate with program risk throughout the product pipeline and maintain the United States as the global source for high-end, secure, and reliable microelectronics components. In addition, this project will develop new data driven risk-based assurance methodologies for supply chain protection to strengthen security while improving access, without exposing sensitive intellectual property (IP) to the foundry and requiring post-manufacture validation of foundry products. The project will develop evidence-based assured design concepts in manufactured systems, enabling a formal risk-based approach to protection techniques.

| Activity (R-2A) | FY2025 | FY2026 | FY2027 |
|---|---|---|---|
| Create an Evidence-Based Assured Microelectronics Pipeline – Development | 140.0 | 139.5 | 25.6 |

> R-2A activities carry the prior, current and budget year only — no five-year plan. Coverage is partial, so count them, never total them.

### Project 907 — Access to State-of-the-Art (SOTA) Microelectronics - Development

This project establishes strategic partnerships with commercial SOTA domestic foundries to develop a data-driven, risk- based approaches to supply chain protection and develops the assured access, secure design, and manufacturing capability of advanced microelectronics technology and electronic components. This project funds microelectronics software assurance (SwA) support to DoW programs and supports the activities of the Joint Federated Assurance Center (JFAC), codified in the National Defense Authorization Act (NDAA) for Fiscal Year 2025, Sec 922, to support the assurance needs of the DoW by ensuring, pursuant to policies related to hardware and software assurance and supply chain risk management, that the software and hardware developed, acquired, maintained, and used by the Department are free from intentional and unintentional vulnerability during the life-cycle of development and deployment of assured, trustworthy defense systems. Projects are transitioning technologies into DoW systems and platforms, ensuring access to multiple onshore commercial microelectronics facilities, establishing secure design capabilities, implementing an evidence-based approach to supply chain protection, and developing technologies for situational awareness of the global microelectronics supply chain. This project builds the foundation for updating and strengthening DoW assurance methods and standards with industry to develop data driven evidence-based practices.

| Activity (R-2A) | FY2025 | FY2026 | FY2027 |
|---|---|---|---|
| Joint Federated Assurance Center (JFAC) | — | 9.1 | 9.5 |
| Access to State-of-the-Art (SOTA) Microelectronics - Development | 311.8 | 115.9 | 5.4 |

> R-2A activities carry the prior, current and budget year only — no five-year plan. Coverage is partial, so count them, never total them.

### Project 908 — Access to Advanced Packaging and Testing - Development

Advanced packaging provides necessary performance improvements, size, weight, power, and cost (SWAP-C) benefits, and unique opportunities to disaggregate DoW requirements into smaller and lower cost chiplets while maximally leveraging SOTA commercial technologies. However, domestic advanced packaging capabilities are limited and the heterogeneous integrated (HI) chiplet ecosystem is nascent. This project is a collaborative effort among the DoW, the Defense Industrial Base (DIB), and domestic commercial industry to leverage and enhance existing capabilities to develop self-sustaining advanced packaging and test solutions that meet DoW needs.

| Activity (R-2A) | FY2025 | FY2026 | FY2027 |
|---|---|---|---|
| Access to Advanced Packaging and Testing - Development | 53.0 | 97.3 | 7.7 |

> R-2A activities carry the prior, current and budget year only — no five-year plan. Coverage is partial, so count them, never total them.

### Project 271 — Software Assurance

This project funds microelectronics software assurance (SwA) support to DoW programs and supports the activities of the Joint Federated Assurance Center (JFAC), codified in the National Defense Authorization Act (NDAA) for Fiscal Year 2025, Sec 922, to support the assurance needs of the DoW by ensuring, pursuant to policies related to hardware and software assurance and supply chain risk management, that the software and hardware developed, acquired, maintained, and used by the Department are free from intentional and unintentional vulnerability during the life-cycle of development and deployment of assured, trustworthy defense systems.

| Activity (R-2A) | FY2025 | FY2026 | FY2027 |
|---|---|---|---|
| Joint Federated Assurance Center (JFAC) | 8.5 | — | — |

> R-2A activities carry the prior, current and budget year only — no five-year plan. Coverage is partial, so count them, never total them.

### Project 294 — Classified Microelectronics Project

Classified Microelectronics Project

| Activity (R-2A) | FY2025 | FY2026 | FY2027 |
|---|---|---|---|
| Classified Microelectronics Project | 150.0 | — | — |

> R-2A activities carry the prior, current and budget year only — no five-year plan. Coverage is partial, so count them, never total them.

## Where the FY2027 request goes

| Category | Share | $M |
|---|---|---|
| Government labs & warfare centers | 100% | 156.7 |

> R-3 exhibit contract funding, not USAspending obligations.

## Mission & acquisition strategy

This program provides microelectronics development and prototyping activities that support the 2026 National Defense Strategy Line of Effort to supercharge the United States Defense Industrial Base through building out capacity, empowering innovators and adopting new advancements in technology, guided by the Department’s policy on Assured Access to Trusted Microelectronics, and 10 USC 4128, Joint Federated Assurance Center. Microelectronics and their supporting supply chains face unprecedented and constantly changing and evolving security risks that threaten national security and the performance of Department of War (DoW) systems and technologies.

N/A

## Related program elements

- [0208097JCY — Cyber Command and Control (C2)](https://hitchintel.com/programs/0208097JCY) (Defense-Wide)
- [0603950D8Z — National Security Innovation Network](https://hitchintel.com/programs/0603950D8Z) (Defense-Wide)
- [0604604F — Joint Smart Munitions Test and Evaluation](https://hitchintel.com/programs/0604604F) (Air Force)
- [0207697F — JFCOM Wargaming](https://hitchintel.com/programs/0207697F) (Air Force)

## Source & machine access

- **Source:** FY2027 Office of the Secretary of Defense RDT&E Budget Justification, Exhibits R-2/R-3, PE 0604294D8Z (PB PB2027); FY2027 NDAA committee marks (as of 2026-07-27).
- **MCP:** `mcp.hitchintel.com` — `budget_get_program_element(pe="0604294D8Z")`.

*HitchAI is an independent intelligence service, not affiliated with the U.S. Department of Defense. Budget figures are requests/estimates, not obligations.*