# Project 908 — Access to Advanced Packaging and Testing - Development

**Program element:** 0604294D8Z — Trusted and Assured Microelectronics  
**Project:** 908  
**Component:** Defense-Wide  
**Appropriation:** 0400 — RDT&E, Defense-Wide  
**Budget Activity:** 4 — Advanced Component Development & Prototypes  
**Vintage:** President's Budget PB2027  
**Canonical URL:** https://hitchintel.com/programs/0604294D8Z/908  
**Parent:** https://hitchintel.com/programs/0604294D8Z

## Summary

Project 908 — Access to Advanced Packaging and Testing - Development requests $7.7M in FY2027, 4.9% of the $156.7M requested for program element 0604294D8Z, down 92% on FY2026. 1 R-2A activity decomposes the request.

## Funding profile

| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 53.0 |
| FY2026 | Enacted | 97.3 |
| FY2027 | Request | 7.7 |
| FY2028 | Outyear | 9.4 |
| FY2029 | Outyear | 10.6 |
| FY2030 | Outyear | 11.6 |
| FY2031 | Outyear | 11.6 |

> Estimate types are not summed. This project is one leaf of PE 0604294D8Z; the PE total is the sum of its projects, never added to them.

## What project 908 buys

Advanced packaging provides necessary performance improvements, size, weight, power, and cost (SWAP-C) benefits, and unique opportunities to disaggregate DoW requirements into smaller and lower cost chiplets while maximally leveraging SOTA commercial technologies. However, domestic advanced packaging capabilities are limited and the heterogeneous integrated (HI) chiplet ecosystem is nascent. This project is a collaborative effort among the DoW, the Defense Industrial Base (DIB), and domestic commercial industry to leverage and enhance existing capabilities to develop self-sustaining advanced packaging and test solutions that meet DoW needs.

**R-3 lines of work:** Product Development.

## Activities (R-2A) — 1

| Activity | FY2025 | FY2026 | FY2027 | Move | Page |
|---|---|---|---|---|---|
| Access to Advanced Packaging and Testing - Development | 53.0 | 97.3 | 7.7 | −92% | — |

> Activities carry the prior, current and budget year only — no five-year plan. In the request year they partition this project exactly; in earlier years they can under-cover it.

### Access to Advanced Packaging and Testing - Development

**FY2027 planned work.** • Focus on advanced packaging technology for digital, analog, and mixed-signal applications for DoW transition partners. • Test, evaluate, and analyze MCP solutions for transition to DoW systems.

**FY2026 to FY2027 change.** The decrease of $89.625 million between FY 2026 and FY 2027 is due to priority realignment for DoW critical technologies.

**FY2026 plans — current year.** Establish and accelerate access to SOTA facilities capable of packaging, testing and delivering integrated circuits in which the fully assembled and operationally functional Multi-Chip Package (MCP) can meet DoW information handling and performance requirements. Promote reuse and standardization for sustainability and cost reduction to drive transition. Ongoing planned activities are as follows: • Development of advanced dual-use multi-chip packages (MCPs) and DoW requirement-driven chiplets • Lower barriers between DIB and high-volume commercial technologies to enable faster and lower cost prototyping of custom chiplets and MCPs • Develop prototypes using ITAR compliant production-ready advanced packaging • Development 2.5D RF packaging design and assembly technologies • Enhance secure design and packaging capability with new tools/techniques • Utilize advanced radio frequency (RF) packaging design tools, process design kits (PDKs), assembly design kits (ADKs), and platforms using a wide selection of material choices.

**FY2025 accomplishments.** Continue the establishment of, and accelerate access to, SOTA packaging and test facilities capable of packaging, testing and personalization of integrated circuits in which the fully assembled and operationally functional Multi-Chip Package (MCP) can contain ITAR regulated and/or classified information. Continue to ensure reuse and standardization for sustainability and costs. Continue executing transition strategy through engagement with programs offices and DIB, data driven analyses, and risk reduction. Continue to expand and accelerate the development of: • Advanced packaging capability utilizing re-shored commercial manufacturing, assembly, domestically sourced materials, and test for productization and qualification. • Processes and capabilities to meet DoD’s heterogeneous integration (HI) packaging unique design needs • Advanced radio frequency (RF) packaging design tools, process design kits (PDKs), assembly design kits (ADKs), and platforms using a wide selection of material choices. • A catalog of designs, die, chiplets, package types, etc. • Prototyping microelectronics evidence-based assurance guidance for microelectronics heterogeneous integrated packaging • Enhance secure design and packaging capability with new tools/techniques. • Post-assembly personalization and operational test capabilities. • MCP finish capability for additional security to protect DoD specific intellectual property (IP) and critical program information (CPI) in the fully functional MCP.

## What is NOT on this page

Congressional marks, the R-2 mission description and acquisition strategy, the industry vs government split of the whole request, and related program elements are recorded at **program-element** grain — an NDAA mark lands on a PE, never on a project. They are at https://hitchintel.com/programs/0604294D8Z.

## Source & machine access

- **Source:** FY2027 Office of the Secretary of Defense RDT&E Budget Justification, Exhibits R-2/R-2A/R-3, PE 0604294D8Z project 908 (PB PB2027).
- **MCP:** `mcp.hitchintel.com` — `budget_get_program_element(pe="0604294D8Z")`.

*HitchAI is an independent intelligence service, not affiliated with the U.S. Department of Defense. Budget figures are requests/estimates, not obligations.*