# Trusted and Assured Microelectronics — Program Element 0605294D8Z

**Program element:** 0605294D8Z  
**Component:** Defense-Wide  
**Appropriation:** 0400 — RDT&E, Defense-Wide  
**Budget Activity:** 5 — System Development & Demonstration  
**Vintage:** President's Budget PB2027  
**Canonical URL:** https://hitchintel.com/programs/0605294D8Z

## Summary

Defense-Wide funding falls 61% to a $51.2M request in FY2027, sustained across the five-year plan. In the FY2027 defense authorization, the House funded it in full; the Senate added 195% (to $151.2M); House appropriators funded it in full.

## Funding profile

| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 145.5 |
| FY2026 | Enacted | 132.8 |
| FY2027 | Request | 51.2 |
| FY2028 | Outyear | 55.9 |
| FY2029 | Outyear | 59.5 |
| FY2030 | Outyear | 62.0 |
| FY2031 | Outyear | 62.0 |

> Estimate types are not summed — the profile mixes actuals, enacted law, the request, and outyear projections.

## Congressional marks (FY2027)

| Stage | Marked ($M) | Change ($M) |
|---|---|---|
| Request | 51.2 | — |
| House NDAA (HASC) | 51.2 | +0.0 |
| Senate NDAA (SASC) | 151.2 | +100.0 |
| House Approps (HAC-D) | 51.2 | +0.0 |

> FY2027 NDAA authorization marks, as of 2026-07-27. Not appropriations or final law.

## Projects (3)

| Project | Title | FY2025 actual | FY2026 enacted | FY2027 request | Move |
|---|---|---|---|---|---|
| 903 | Access to Advanced Packaging and Testing - Demonstration | 46.1 | 27.7 | 25.8 | −7% |
| 905 | DOW Unique NDS RADHARD - Demonstration | 46.7 | 24.3 | 23.4 | −4% |
| 902 | Access to State-of-the-Art (SOTA) Microelectronics - Demonstration | 52.7 | 80.7 | 2.1 | −97% |

> Projects are the summable leaves: the program element total is their sum, never added to it.

### Project 903 — Access to Advanced Packaging and Testing - Demonstration

Advanced packaging provides essential performance improvements, size, weight, power, and cost (SWAP-C) benefits, and unique opportunities to disaggregate DoW requirements into smaller and lower cost chiplets while maximally leveraging state-of-the-art (SOTA) commercial technologies. However domestic advanced packaging capabilities are limited and the heterogeneously integrated (HI) chiplet ecosystem is nascent. This project is a collaborative effort among the DoW, Defense Industrial Base (DIB), and domestic commercial industry to expand existing capabilities to demonstrate advanced packaging and test solutions that meet DoW needs.

| Activity (R-2A) | FY2025 | FY2026 | FY2027 |
|---|---|---|---|
| Access to Advanced Packaging and Testing - Demonstration | 46.1 | 27.7 | 25.8 |

> R-2A activities carry the prior, current and budget year only — no five-year plan. Coverage is partial, so count them, never total them.

### Project 905 — DOW Unique NDS RADHARD - Demonstration

The DoW relies on a small number of specialty suppliers to develop and acquire the application specific integrated circuits (ASICs) and specialized or modified commercial components required to satisfy military needs for radiation hardened digital and analog microelectronics. By partnering in the demonstration of SOTA material sources, foundries, and packaging facilities, the DoW is aligning commercial practices with unique needs for performance and functionality, and encouraging open access design to stimulate innovation and drive affordability. Expanding the manufacturing capability and capacity of facilities for fabrication, packaging, and testing are all enablers to ensuring availability of radiation hardened microelectronics.

| Activity (R-2A) | FY2025 | FY2026 | FY2027 |
|---|---|---|---|
| Access to Radiation Hardened-, RF-, and Opto-Electronic - Demonstration | 46.7 | 24.3 | 23.4 |

> R-2A activities carry the prior, current and budget year only — no five-year plan. Coverage is partial, so count them, never total them.

### Project 902 — Access to State-of-the-Art (SOTA) Microelectronics - Demonstration

This project establishes multiple strategic partnerships with existing commercial state-of-the-art (SOTA) domestic foundries to develop a data-driven, evidence-based approach to supply chain protection and demonstrate the assured manufacture of advanced electronic components. It enables the DoW to leverage the rapid advancements in microelectronics technology while maintaining trust and assurance in microelectronics with on shore advanced fabrication capabilities. Successful implementations will transition SOTA technologies into DoW systems and platforms, enable access to multiple on shore commercial microelectronics facilities, establish secure design capabilities, and implement a data-driven evidence-based approach to supply chain protection. Additionally, this project drives collaboration with industry to apply evidence-based assurance methodologies.

| Activity (R-2A) | FY2025 | FY2026 | FY2027 |
|---|---|---|---|
| Access to State-of-the-Art (SOTA) Microelectronics - Demonstration | 52.7 | 80.7 | 2.1 |

> R-2A activities carry the prior, current and budget year only — no five-year plan. Coverage is partial, so count them, never total them.

## Where the FY2027 request goes

| Category | Share | $M |
|---|---|---|
| Government labs & warfare centers | 100% | 51.2 |

> R-3 exhibit contract funding, not USAspending obligations.

## Mission & acquisition strategy

This program provides microelectronics demonstration activities that enable warfighting systems and platforms to keep pace with commercial microelectronics technological advances, reduce reliance on obsolete microelectronics, and mitigate the Department’s reliance on sole source and offshore foundries for assured state-of-the-art (SOTA) microelectronics. It focuses on enduring access to a multiplicity of modern on shore manufacturing processes, leveraging commercial volumes to maintain long term viability and protects the intellectual property (IP) of the microelectronic parts that are manufactured.

N/A

## Related program elements

- [0605296F — Microelectronics Secure Enclave](https://hitchintel.com/programs/0605296F) (Air Force)
- [0603739E — Advanced Electronics Technologies](https://hitchintel.com/programs/0603739E) (Defense-Wide)
- [0603720S — Microelectronics Technology Development and Support (DMEA)](https://hitchintel.com/programs/0603720S) (Defense-Wide)
- [0604707N — SEW Architecture/Eng Support](https://hitchintel.com/programs/0604707N) (Navy)

## Source & machine access

- **Source:** FY2027 Office of the Secretary of Defense RDT&E Budget Justification, Exhibits R-2/R-3, PE 0605294D8Z (PB PB2027); FY2027 NDAA committee marks (as of 2026-07-27).
- **MCP:** `mcp.hitchintel.com` — `budget_get_program_element(pe="0605294D8Z")`.

*HitchAI is an independent intelligence service, not affiliated with the U.S. Department of Defense. Budget figures are requests/estimates, not obligations.*