# Project 902 — Access to State-of-the-Art (SOTA) Microelectronics - Demonstration

**Program element:** 0605294D8Z — Trusted and Assured Microelectronics  
**Project:** 902  
**Component:** Defense-Wide  
**Appropriation:** 0400 — RDT&E, Defense-Wide  
**Budget Activity:** 5 — System Development & Demonstration  
**Vintage:** President's Budget PB2027  
**Canonical URL:** https://hitchintel.com/programs/0605294D8Z/902  
**Parent:** https://hitchintel.com/programs/0605294D8Z

## Summary

Project 902 — Access to State-of-the-Art (SOTA) Microelectronics - Demonstration requests $2.1M in FY2027, 4.0% of the $51.2M requested for program element 0605294D8Z, down 97% on FY2026. 1 R-2A activity decomposes the request.

## Funding profile

| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 52.7 |
| FY2026 | Enacted | 80.7 |
| FY2027 | Request | 2.1 |
| FY2028 | Outyear | 1.9 |
| FY2029 | Outyear | 4.4 |
| FY2030 | Outyear | 5.7 |
| FY2031 | Outyear | 5.7 |

> Estimate types are not summed. This project is one leaf of PE 0605294D8Z; the PE total is the sum of its projects, never added to them.

## What project 902 buys

This project establishes multiple strategic partnerships with existing commercial state-of-the-art (SOTA) domestic foundries to develop a data-driven, evidence-based approach to supply chain protection and demonstrate the assured manufacture of advanced electronic components. It enables the DoW to leverage the rapid advancements in microelectronics technology while maintaining trust and assurance in microelectronics with on shore advanced fabrication capabilities. Successful implementations will transition SOTA technologies into DoW systems and platforms, enable access to multiple on shore commercial microelectronics facilities, establish secure design capabilities, and implement a data-driven evidence-based approach to supply chain protection. Additionally, this project drives collaboration with industry to apply evidence-based assurance methodologies.

**R-3 lines of work:** Product Development.

## Activities (R-2A) — 1

| Activity | FY2025 | FY2026 | FY2027 | Move | Page |
|---|---|---|---|---|---|
| Access to State-of-the-Art (SOTA) Microelectronics - Demonstration | 52.7 | 80.7 | 2.1 | −97% | — |

> Activities carry the prior, current and budget year only — no five-year plan. In the request year they partition this project exactly; in earlier years they can under-cover it.

### Access to State-of-the-Art (SOTA) Microelectronics - Demonstration

**FY2027 planned work.** Demonstrate, test and evaluate program-targeted chips in concert with transition partners. These efforts include application specific integrated circuits (ASICs) for communications and imaging applications.

**FY2026 to FY2027 change.** The decrease of $78.66 million between FY 2026 and FY 2027 is due to priority realignment for DoW critical technologies.

**FY2026 plans — current year.** • Maintain program of record access to assured fabrication flow and fund multi-project wafer production runs at multiple SOTA domestic sources. • Enable commercially supported and enduring U.S. logic foundry capability for the DoW. • Develop and demonstrate novel capabilities for design with assurance. Provide access to leading edge domestic wafer foundry ecosystem. • Develop and demonstrate emulation-based evidence-based assurance design flows in leading EDA tools. • Construct domain-specific architectures that leverage commercial intellectual property (IP), EDA, and processes enabling accelerated prototype demonstration and transition. • Develop, evaluate, and initiate insertion of IP, for application-specific integrated circuit (ASIC) and chiplet security including authentication, firmware attestation and decryption and system-on-chip interface encryption, tools and techniques to protect silicon IP during manufacturing and test phase, including multi-chip package (MCP).

**FY2025 accomplishments.** Foundry Access and RAMP-C: • Continue to enhance access to SOTA fabrication ecosystem and state-of-the-art (SOTA) U.S. wafer foundry. • Maintain program of record access to assured fabrication flow and fund multi-project wafer production runs at multiple state-of-the-art (SOTA) domestic sources. • Provide access to commercial and critical evidence-based assured dual-use commercial off-the-shelf (COTS) integrated circuits. • Support development of evidence-based assured, custom DoD integrated circuits. • Jump-start commercial use of the domestic foundry by key U.S. fabless companies. • Expand access to design tools including access to 3rd party design modules. • Enable a commercially-supported and enduring U.S. logic foundry capability. • Leverage the expertise of commercial industry to develop and demonstrate novel capabilities for design of SOTA with assurance. Domain Specific Design and Transition: • Validate and leverage application-specific modeling and simulation to anticipate performance benefits to be derived from design and fabrication of DoD microelectronics in advanced (<7 nm) technologies. • Continue activities for prototype demonstration of emulation based evidence-based assurance design flows, leveraging SOTA electronic design automation tools. • Continue efforts to raise the technology readiness level (TRL) of pilot emulation efforts to production readiness. • Continue activities to leverage commercial intellectual property (IP), EDA, and processes to accelerate demonstrate and transition prototypes. • Continue to expand and accelerate development and insertion of IP for application-specific integrated circuit (ASIC) and Chiplet security including authentication, Firmware Attestation and Decryption and system-on-chip (SOC) Interface encryption. • Continue to develop and insert tools and techniques to protect silicon IP during packaging and test phase, including multi-chip package (MCP). • Continue demonstration of using COTS parts in more critical DoD applications utilizing the inherent personalization features

## What is NOT on this page

Congressional marks, the R-2 mission description and acquisition strategy, the industry vs government split of the whole request, and related program elements are recorded at **program-element** grain — an NDAA mark lands on a PE, never on a project. They are at https://hitchintel.com/programs/0605294D8Z.

## Source & machine access

- **Source:** FY2027 Office of the Secretary of Defense RDT&E Budget Justification, Exhibits R-2/R-2A/R-3, PE 0605294D8Z project 902 (PB PB2027).
- **MCP:** `mcp.hitchintel.com` — `budget_get_program_element(pe="0605294D8Z")`.

*HitchAI is an independent intelligence service, not affiliated with the U.S. Department of Defense. Budget figures are requests/estimates, not obligations.*