# Project 903 — Access to Advanced Packaging and Testing - Demonstration

**Program element:** 0605294D8Z — Trusted and Assured Microelectronics  
**Project:** 903  
**Component:** Defense-Wide  
**Appropriation:** 0400 — RDT&E, Defense-Wide  
**Budget Activity:** 5 — System Development & Demonstration  
**Vintage:** President's Budget PB2027  
**Canonical URL:** https://hitchintel.com/programs/0605294D8Z/903  
**Parent:** https://hitchintel.com/programs/0605294D8Z

## Summary

Project 903 — Access to Advanced Packaging and Testing - Demonstration requests $25.8M in FY2027, 50% of the $51.2M requested for program element 0605294D8Z, down 7.0% on FY2026. 1 R-2A activity decomposes the request.

## Funding profile

| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 46.1 |
| FY2026 | Enacted | 27.7 |
| FY2027 | Request | 25.8 |
| FY2028 | Outyear | 26.5 |
| FY2029 | Outyear | 27.0 |
| FY2030 | Outyear | 27.5 |
| FY2031 | Outyear | 27.5 |

> Estimate types are not summed. This project is one leaf of PE 0605294D8Z; the PE total is the sum of its projects, never added to them.

## What project 903 buys

Advanced packaging provides essential performance improvements, size, weight, power, and cost (SWAP-C) benefits, and unique opportunities to disaggregate DoW requirements into smaller and lower cost chiplets while maximally leveraging state-of-the-art (SOTA) commercial technologies. However domestic advanced packaging capabilities are limited and the heterogeneously integrated (HI) chiplet ecosystem is nascent. This project is a collaborative effort among the DoW, Defense Industrial Base (DIB), and domestic commercial industry to expand existing capabilities to demonstrate advanced packaging and test solutions that meet DoW needs.

**R-3 lines of work:** Product Development.

## Activities (R-2A) — 1

| Activity | FY2025 | FY2026 | FY2027 | Move | Page |
|---|---|---|---|---|---|
| Access to Advanced Packaging and Testing - Demonstration | 46.1 | 27.7 | 25.8 | −7% | [a0](https://hitchintel.com/programs/0605294D8Z/903/a0) |

> Activities carry the prior, current and budget year only — no five-year plan. In the request year they partition this project exactly; in earlier years they can under-cover it.

### Access to Advanced Packaging and Testing - Demonstration

• Adaptive Compute Acceleration Platform Chiplet (“ACAP”) will complete productization in 1Q FY 2027. • Performance Optimization with Wideband Enhanced Radio-Frequency Unified Package (“POWER-UP”) Multi-Chip Package (MCP) integrating gallium nitride (GaN) high-power amplifiers (HPA), GaN low-noise amplifiers (LNA), and a silicon…

Full year-by-year narrative: https://hitchintel.com/programs/0605294D8Z/903/a0

## What is NOT on this page

Congressional marks, the R-2 mission description and acquisition strategy, the industry vs government split of the whole request, and related program elements are recorded at **program-element** grain — an NDAA mark lands on a PE, never on a project. They are at https://hitchintel.com/programs/0605294D8Z.

## Source & machine access

- **Source:** FY2027 Office of the Secretary of Defense RDT&E Budget Justification, Exhibits R-2/R-2A/R-3, PE 0605294D8Z project 903 (PB PB2027).
- **MCP:** `mcp.hitchintel.com` — `budget_get_program_element(pe="0605294D8Z")`.

*HitchAI is an independent intelligence service, not affiliated with the U.S. Department of Defense. Budget figures are requests/estimates, not obligations.*