# Project 905 — DOW Unique NDS RADHARD - Demonstration

**Program element:** 0605294D8Z — Trusted and Assured Microelectronics  
**Project:** 905  
**Component:** Defense-Wide  
**Appropriation:** 0400 — RDT&E, Defense-Wide  
**Budget Activity:** 5 — System Development & Demonstration  
**Vintage:** President's Budget PB2027  
**Canonical URL:** https://hitchintel.com/programs/0605294D8Z/905  
**Parent:** https://hitchintel.com/programs/0605294D8Z

## Summary

Project 905 — DOW Unique NDS RADHARD - Demonstration requests $23.4M in FY2027, 46% of the $51.2M requested for program element 0605294D8Z, down 4.0% on FY2026. 1 R-2A activity decomposes the request.

## Funding profile

| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 46.7 |
| FY2026 | Enacted | 24.3 |
| FY2027 | Request | 23.4 |
| FY2028 | Outyear | 27.5 |
| FY2029 | Outyear | 28.1 |
| FY2030 | Outyear | 28.8 |
| FY2031 | Outyear | 28.8 |

> Estimate types are not summed. This project is one leaf of PE 0605294D8Z; the PE total is the sum of its projects, never added to them.

## What project 905 buys

The DoW relies on a small number of specialty suppliers to develop and acquire the application specific integrated circuits (ASICs) and specialized or modified commercial components required to satisfy military needs for radiation hardened digital and analog microelectronics. By partnering in the demonstration of SOTA material sources, foundries, and packaging facilities, the DoW is aligning commercial practices with unique needs for performance and functionality, and encouraging open access design to stimulate innovation and drive affordability. Expanding the manufacturing capability and capacity of facilities for fabrication, packaging, and testing are all enablers to ensuring availability of radiation hardened microelectronics.

**R-3 lines of work:** Product Development.

## Activities (R-2A) — 1

| Activity | FY2025 | FY2026 | FY2027 | Move | Page |
|---|---|---|---|---|---|
| Access to Radiation Hardened-, RF-, and Opto-Electronic - Demonstration | 46.7 | 24.3 | 23.4 | −4% | [a0](https://hitchintel.com/programs/0605294D8Z/905/a0) |

> Activities carry the prior, current and budget year only — no five-year plan. In the request year they partition this project exactly; in earlier years they can under-cover it.

### Access to Radiation Hardened-, RF-, and Opto-Electronic - Demonstration

• Demonstrate developed technologies for tactical datalink applications, including developments in optical communications, GaN technology, and multi-chip packaging advancements to improve the data rate and link range in representative environments, and accelerate transition to the warfighter. • Demonstrate and validate the manufacturing…

Full year-by-year narrative: https://hitchintel.com/programs/0605294D8Z/905/a0

## What is NOT on this page

Congressional marks, the R-2 mission description and acquisition strategy, the industry vs government split of the whole request, and related program elements are recorded at **program-element** grain — an NDAA mark lands on a PE, never on a project. They are at https://hitchintel.com/programs/0605294D8Z.

## Source & machine access

- **Source:** FY2027 Office of the Secretary of Defense RDT&E Budget Justification, Exhibits R-2/R-2A/R-3, PE 0605294D8Z project 905 (PB PB2027).
- **MCP:** `mcp.hitchintel.com` — `budget_get_program_element(pe="0605294D8Z")`.

*HitchAI is an independent intelligence service, not affiliated with the U.S. Department of Defense. Budget figures are requests/estimates, not obligations.*