# Project E25 — Mfg Science & Tech

**Program element:** 0708045A — End Item Industrial Preparedness Activities  
**Project:** E25  
**Component:** U.S. Army  
**Appropriation:** 2040 — RDT&E, Army  
**Budget Activity:** 7 — Operational System Development  
**Vintage:** President's Budget PB2027  
**Canonical URL:** https://hitchintel.com/programs/0708045A/E25  
**Parent:** https://hitchintel.com/programs/0708045A

## Summary

Project E25 — Mfg Science & Tech requests $68.1M in FY2027, 100% of the $68.1M requested for program element 0708045A, up 3.4% on FY2026. 5 R-2A activities decompose the request.

## Funding profile

| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 64.9 |
| FY2026 | Enacted | 65.8 |
| FY2027 | Request | 68.1 |
| FY2028 | Outyear | 68.8 |
| FY2029 | Outyear | 69.3 |
| FY2030 | Outyear | 70.0 |
| FY2031 | Outyear | 70.7 |

> Estimate types are not summed. This project is one leaf of PE 0708045A; the PE total is the sum of its projects, never added to them.

## What project E25 buys

This Project develops and demonstrates manufacturing technologies and processes that enable improvements in producibility and affordability of emerging and enabling components and subsystems of Army ground and air platforms, Soldier systems, weapons systems, air and missile defense systems, and sensors and electronics. Work is performed to advance the state-of-the-art, leveraging automation in manufacturing processing and fabrication techniques for coatings, multifunctional materials, and structural elements for Army-specific applications.

**R-3 lines of work:** Product Development.

## Activities (R-2A) — 5

| Activity | FY2025 | FY2026 | FY2027 | Move | Page |
|---|---|---|---|---|---|
| Ground Systems | 15.1 | 17.6 | 25.8 | +47% | [a2](https://hitchintel.com/programs/0708045A/E25/a2) |
| Weapon Systems | 20.3 | 16.0 | 23.5 | +46% | [a1](https://hitchintel.com/programs/0708045A/E25/a1) |
| Networks and Command, Control, Communications and Intelligence | 15.5 | 15.2 | 8.3 | −45% | — |
| Aviation Systems | 7.3 | 5.6 | 5.3 | −5% | — |
| Soldier Systems | 6.7 | 11.5 | 5.2 | −54% | — |

> Activities carry the prior, current and budget year only — no five-year plan. In the request year they partition this project exactly; in earlier years they can under-cover it.

### Ground Systems

Continue addressing advanced manufacturing processes for high-performance / lower-weight armor materials for Army platforms and ramp up efforts focused on manufacturing advanced systems for ground platforms. Continue effort to reduce RDX production requirements for the MICLIC to improve manufacturability and effectiveness while reducing…

Full year-by-year narrative: https://hitchintel.com/programs/0708045A/E25/a2

### Weapon Systems

Continue supporting AMD capabilities focused on the affordability and producibility of DE systems, cannon tube production optimization, improving cold-plate brazing for high-power radar systems, and additive manufacturing processes for high-power radar systems, munitions, and scramjet components. Initiate efforts to reduce cost and…

Full year-by-year narrative: https://hitchintel.com/programs/0708045A/E25/a1

### Networks and Command, Control, Communications and Intelligence

**FY2027 planned work.** Continue cost reduction of anti-jammer antennas, eliminating the interlayer epoxy in the manufacture of compound semiconductors to dramatically improve transmission and simplify the FPA fabrication process, and simplifying the manufacturing process and improving yield, cost, and performance of IR sensor layers utilizing direct bond interfacing. Initiate efforts to reduce lens count and manufacturing costs for dual-band IR sensors.

**FY2026 to FY2027 change.** The decrease in funding reflects continued work in anti-jammer antenna cost reduction; simplifying the manufacturing process and improving yield, cost, and performance of IR sensor layers utilizing direct bond interfacing; and reducing the lens count and manufacturing costs for dual-band IR sensors.

**FY2026 plans — current year.** Continue developing and advancing manufacturing processes and capabilities supporting command-and-control systems/ subsystems and A-PNT systems. Continue supporting Low-Cost Chip-Scale Atomic Clock (LCCSAC), improvement of silicon foundry processes to produce next-generation read-out integrated circuits (ROIC), cost reduction of anti-jammer antennas, production improvements to wafers designed for advanced weapons sensor systems, the elimination of the interlayer epoxy in the manufacture of compound semiconductors to dramatically improve transmission and simplify the focal plan array (FPA) fabrication process, and simplifying the manufacturing process and improving yield, cost, and performance of infrared (IR) sensor layers utilizing direct bond interfacing.

**FY2025 accomplishments.** Program plans will continue to develop and advance manufacturing processes and capabilities supporting command and control systems/subsystems and position, navigation, and timing systems. Specific plans include continued support to the Low Chip Scale Atomic Clock and initiate efforts to lower production cost and scalability. Additionally, initiate efforts to support the modernization of silicon foundry processes for the production of next generation sensor read out circuits to improve Warfighter situational awareness.

### Aviation Systems

**FY2027 planned work.** Program plans will continue to mature manufacturing processes and capabilities supporting rotary aircraft components and UAS, leveraging advanced manufacturing techniques (e.g., additive manufacturing, cold spray).

**FY2026 to FY2027 change.** The decrease in funding reflects production process improvements of future long-range assault capabilities and launched effects.

**FY2026 plans — current year.** Program plans will continue to develop and advance manufacturing processes and capabilities supporting aviation platforms for future attack, reconnaissance and long-range assault capabilities, and air launched effects. Continue additive manufacturing efforts supporting leading edges (rotary aircraft advanced blades) production capability.

**FY2025 accomplishments.** Program plans will continue to develop and advance manufacturing processes and capabilities supporting aviation platforms for future attack, reconnaissance and long range assault capabilities, and air launched effects. Continue additive manufacturing efforts supporting leading edges (rotary aircraft advanced blades) production capability.

### Soldier Systems

**FY2027 planned work.** Continue production process improvements for next-generation 6.8mm ammunition and production process improvements for the manufacturing of low-cost flame-resistant textiles.

**FY2026 to FY2027 change.** The decrease in funding reflects production process improvements for next-generation 6.8mm ammunition and low-cost flame-resistant textiles manufacturing.

**FY2026 plans — current year.** Program plans will increase the capability of individual Soldier weapons, provide Soldiers with enhanced capabilities, and increase their protection and ability to respond to emerging situations through advanced manufacturing processes. Efforts include continued production process improvements for the manufacturing of low-cost flame-resistant textiles, the loading of detonators and initiators using slurry-based material, and next-generation 6.8mm ammunition.

**FY2025 accomplishments.** Efforts will result in greater affordability and producibility with a concentration on next generation squad weapons and ammunition, Soldier borne power, enhanced protective materials and systems, and sensor development. Efforts include continued production processes improvements for superior vision protection and advanced processes for food production.

## What is NOT on this page

Congressional marks, the R-2 mission description and acquisition strategy, the industry vs government split of the whole request, and related program elements are recorded at **program-element** grain — an NDAA mark lands on a PE, never on a project. They are at https://hitchintel.com/programs/0708045A.

## Source & machine access

- **Source:** FY2027 Department of the Army RDT&E Budget Justification, Exhibits R-2/R-2A/R-3, PE 0708045A project E25 (PB PB2027).
- **MCP:** `mcp.hitchintel.com` — `budget_get_program_element(pe="0708045A")`.

*HitchAI is an independent intelligence service, not affiliated with the U.S. Department of Defense. Budget figures are requests/estimates, not obligations.*