What project AET-02 buys
The Advanced Disruptive Microtechnologies project supports activities to enable and accelerate the transition of advanced microsystems advancement, including those developed under the Disruptive Microtechnologies Sciences (EMR-02) and Disruptive Microtechnologies (MSL-02) projects. Funding under this project will include quantum circuits for computation and sensing; integrated photonic-electronic components for timing and data transfer; and developing new technologies and capabilities that intelligently leverage commercial scaling while still preserving advanced capabilities for the warfighter. Prior to FY 2026, efforts in this Project were funded in PE 0603739E, Projects MT-15 and MT-16.
Project AET-02 funding, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure. Projects carry the full five-year plan; the activities inside them stop at the budget year.
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 0.0 |
| FY2026 | Enacted | 212.4 |
| FY2027 | Request | 212.5 |
| FY2028 | Outyear | 229.0 |
| FY2029 | Outyear | 237.1 |
| FY2030 | Outyear | 238.5 |
| FY2031 | Outyear | 238.5 |
4 accomplishments / planned programs
The R-2A exhibit — the only level of the budget that describes work that has not happened yet. Activities carry the prior, current and budget year only, no five-year plan. 2 of them describe FY2027 work in enough detail to have their own page; the rest are shown here in full. Coverage is partial across the corpus, so count activities, never total them.
- Update self-sufficiency plans based on projections from members and customer outreach. - Update roadmap with revised assessment of technical and business capabilities. - Improve yield of 3DHI fabrication process modules, including thermocompression bonding, hybrid bonding, and metal patterning. - Establish capability for processing…
Read the FY2027 plan →- Perform relevant activities related to accelerating the transition of quantum technologies. - Initiate design of photonic-electronic components for timing and data transfer for relevant use cases. - Initiate activities related to intelligently leveraging commercial scaling to provide advanced capabilities for the warfighter.
Read the FY2027 plan →FY2027 planned work - Fabricate integrated laser tiles with optical amplifiers, phase control, and thermal management. - Integrate laser tiles into panelized high energy laser (HEL) array with high power and high efficiency. - Demonstrate a fully integrated HEL array.
FY2026 to FY2027 change The FY 2027 decrease reflects a shift from finalizing fabrication and assembly to demonstration of fully integrated laser tile.
FY2026 plans — current year - Fabricate full laser tile array of semiconductor amplifiers with good electrical-to-optical efficiency. - Integrate full laser tiles with semiconductor amplifiers, phase sensing and control, and power and thermal management. - Demonstrate a fully integrated laser tile, including a full array beam combination test to show traceability to integration in a panelized array with minimal degradation in beam quality.
FY2027 planned work - Demonstrate proof-of-concept solutions in a real-world scenario. - Generalize the techniques to multiple different processors.
FY2026 to FY2027 change The FY 2027 decrease reflects the shift from researching a wide array of hardware and software solutions to developing and validating a small number of proof-of-concept solutions.
FY2026 plans — current year - Develop proof-of-concept that errors detected can be corrected within a relevant timeframe. - Develop techniques to minimize overhead during error detection. - Validate proof-of-concept solutions to correlate signatures to software errors within a relevant timeframe.