R-2A Activity · President's Budget PB2027

Next Generation Microelectronics Manufacturing (NGMM)

FY2027 Request
$175.0M
▲ 0.0% vs FY2026
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This activity requests $175.0M in FY2027, 82% of project AET-02, up 0.0% on FY2026. The R-2A exhibit describes it across FY2026–FY2027, including what the FY2027 money is planned to buy.

FY2027 Request
$175.0M
▲ 0.0% vs FY2026
FY2026 Enacted
$175.0M
In law
Planned work

What the FY2027 request buys

Verbatim from the R-2A exhibit for project AET-02 of PE 0603469E. This is the budget justification's own description of work that has not happened yet — the one thing no other level of the budget carries.

FY2027 planned work

- Update self-sufficiency plans based on projections from members and customer outreach. - Update roadmap with revised assessment of technical and business capabilities. - Improve yield of 3DHI fabrication process modules, including thermocompression bonding, hybrid bonding, and metal patterning. - Establish capability for processing non-silicon material substrates on standard silicon processing equipment. - Develop advanced thermal management solutions for integration in 3DHI assemblies. - Demonstrate user portal for external users to access 3D-ADK and purchase design and prototyping services.

Before the request year

FY2026: the year under way

Prior-year accomplishments and current-year plans from the same exhibit. Context for the FY2027 plan, not a series — an activity partitions its project exactly in the request year, but can under-cover it in earlier years.

FY2026 plans — current year

- Develop baseline plan for user access model that addresses membership structure and intellectual property management. - Complete design review of 3DHI process and test vehicles. - Develop and optimize 3DHI fabrication process modules, including thermocompression bonding, hybrid bonding, and metal patterning. - Demonstrate baseline 3DHI test vehicles, including a power amplifier, low noise amplifier, and interposer. - Update design for test, design for manufacturing/yield, and design for reliability standards.

Money

Three years, and no five-year plan

An R-2A activity publishes the prior year, the current year and the budget year. The FYDP outyears exist at project and program-element level and are deliberately absent here rather than inferred. Estimate types are colored and never summed into one figure.

501001500175.0FY26ENACTED175.0FY27REQUEST
Enacted Request
Fiscal YearEstimate TypeAmount ($M)
FY2026Enacted175.0
FY2027Request175.0

This activity is 82% of project AET-02's FY2027 request and 53% of PE 0603469E's. In the request year the activities under a project sum to it exactly; in the current year they under-cover it in about 9% of cases, so an activity's delta can legitimately exceed its parent's and the two must not be compared row to row.

Where this sits

4 activities in project AET-02

Every R-2A line of this project, largest FY2027 request first. Linked where the activity has enough of its own narrative to carry a page; the rest are shown in full on the project page.

Next Generation Microelectronics Manufacturing (NGMM) — this activity$175.0M flat
Advanced Disruptive Microtechnologies Studies and Concepts$22.7M ▲ 114%
Modular Efficient Laser Technology (MELT)$7.4M ▼ 43%
Continuous-correctness On Opaque Processors (COOP)$7.4M ▼ 47%
Source
FY2027 Office of the Secretary of Defense RDT&E Budget Justification · Exhibit R-2A · PE 0603469E, project AET-02 (President's Budget PB2027). Congressional marks are recorded on the program element, never on an activity.
Machine access
Markdown twin /programs/0603469E/AET-02/a0.md · MCP mcp.hitchintel.combudget_get_activity