R-2A Activity · President's Budget PB2027

Photonic Foundry and Packaging Innovation

FY2027 Request
$11.1M
▼ 29% vs FY2026
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This activity requests $11.1M in FY2027, 4.8% of project 350, down 29% on FY2026. The R-2A exhibit describes it across FY2025–FY2027, including what the FY2027 money is planned to buy.

FY2027 Request
$11.1M
▼ 29% vs FY2026
FY2026 Enacted
$15.5M
▼ 6.0% vs FY2025
FY2025 Actual
$16.5M
Prior year
Planned work

What the FY2027 request buys

Verbatim from the R-2A exhibit for project 350 of PE 0603680D8Z. This is the budget justification's own description of work that has not happened yet — the one thing no other level of the budget carries.

FY2027 planned work

Continue to develop and offer next generation integrated photonic circuit fabrication and test, assembly, and packaging (TAP) capabilities to the U.S. ecosystem. Extend design and training opportunities to continue to grow the overall integrated photonic circuit ecosystem. Perform targeted work to explore solutions for long-haul and short-haul photonic data networks with reduced power consumption, improve the variety and performance of laser solutions, target heterogeneous integration opportunities, and expand accessibility to low-loss platforms for sensing and quantum applications.

FY2026 to FY2027 change

A decrease of $4.460 million from FY 2026 to FY 2027 realignment of the DoW armed services requirements being moved to Manufacturing Modernization Sprints.

Before the request year

FY2025–FY2026: what came before

Prior-year accomplishments and current-year plans from the same exhibit. Context for the FY2027 plan, not a series — an activity partitions its project exactly in the request year, but can under-cover it in earlier years.

FY2026 plans — current year

Continue to develop and offer next generation integrated photonic circuit fabrication and test, assembly, and packaging (TAP) capabilities to the U.S. ecosystem. Extend design and training opportunities to continue to grow the overall integrated photonic circuit ecosystem. Perform targeted work to explore solutions for long-haul and short-haul photonic data networks with reduced power consumption, improve the variety and performance of laser solutions, target heterogeneous integration opportunities, and expand accessibility to low-loss platforms for sensing and quantum applications.

FY2025 accomplishments

Continue to develop and offer next generation integrated photonic circuit fabrication and test, assembly, and packaging (TAP) capabilities to the U.S. ecosystem. Extend design and training opportunities to continue to grow the overall integrated photonic circuit ecosystem. Perform targeted work to improve the variety and performance of laser solutions and expand accessibility to low-loss platforms for sensing and quantum applications.

Money

Three years, and no five-year plan

An R-2A activity publishes the prior year, the current year and the budget year. The FYDP outyears exist at project and program-element level and are deliberately absent here rather than inferred. Estimate types are colored and never summed into one figure.

016.5FY25ACTUAL15.5FY26ENACTED11.1FY27REQUEST
Actual Enacted Request
Fiscal YearEstimate TypeAmount ($M)
FY2025Actual16.5
FY2026Enacted15.5
FY2027Request11.1

This activity is 4.8% of project 350's FY2027 request and 1.9% of PE 0603680D8Z's. In the request year the activities under a project sum to it exactly; in the current year they under-cover it in about 9% of cases, so an activity's delta can legitimately exceed its parent's and the two must not be compared row to row.

Where this sits

11 activities in project 350

Every R-2A line of this project, largest FY2027 request first. Linked where the activity has enough of its own narrative to carry a page; the rest are shown in full on the project page.

Adoption of Defense Advanced Manufacturing (ADAM)$130.3M NEWManufacturing Modernization Sprints$28.0M NEW
Photonic Foundry and Packaging Innovation — this activity$11.1M ▼ 29%
Medical Cell, Tissue, and Organ Manufacturing Innovation$10.0M ▼ 7%
Bioindustrial Manufacturing Innovation$8.3M ▼ 55%
Materials Innovation$7.6M ▼ 28%
Robotic Automation Innovation$7.3M ▼ 32%
Manufacturing Digital Innovation$7.2M ▼ 43%
Additive Manufacturing Innovation$7.0M ▼ 81%
Hybrid Electronics Innovation$6.9M ▼ 27%
Advanced Fiber and Fabric$5.3M ▼ 16%
Source
FY2027 Office of the Secretary of Defense RDT&E Budget Justification · Exhibit R-2A · PE 0603680D8Z, project 350 (President's Budget PB2027). Congressional marks are recorded on the program element, never on an activity.
Machine access
Markdown twin /programs/0603680D8Z/350/a3.md · MCP mcp.hitchintel.combudget_get_activity