What project 908 buys
Advanced packaging provides necessary performance improvements, size, weight, power, and cost (SWAP-C) benefits, and unique opportunities to disaggregate DoW requirements into smaller and lower cost chiplets while maximally leveraging SOTA commercial technologies. However, domestic advanced packaging capabilities are limited and the heterogeneous integrated (HI) chiplet ecosystem is nascent. This project is a collaborative effort among the DoW, the Defense Industrial Base (DIB), and domestic commercial industry to leverage and enhance existing capabilities to develop self-sustaining advanced packaging and test solutions that meet DoW needs.
- Product Development
Project 908 funding, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure. Projects carry the full five-year plan; the activities inside them stop at the budget year.
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 53.0 |
| FY2026 | Enacted | 97.3 |
| FY2027 | Request | 7.7 |
| FY2028 | Outyear | 9.4 |
| FY2029 | Outyear | 10.6 |
| FY2030 | Outyear | 11.6 |
| FY2031 | Outyear | 11.6 |
1 accomplishment / planned program
The R-2A exhibit — the only level of the budget that describes work that has not happened yet. Activities carry the prior, current and budget year only, no five-year plan. Coverage is partial across the corpus, so count activities, never total them.
FY2027 planned work • Focus on advanced packaging technology for digital, analog, and mixed-signal applications for DoW transition partners. • Test, evaluate, and analyze MCP solutions for transition to DoW systems.
FY2026 to FY2027 change The decrease of $89.625 million between FY 2026 and FY 2027 is due to priority realignment for DoW critical technologies.
FY2026 plans — current year Establish and accelerate access to SOTA facilities capable of packaging, testing and delivering integrated circuits in which the fully assembled and operationally functional Multi-Chip Package (MCP) can meet DoW information handling and performance requirements. Promote reuse and standardization for sustainability and cost reduction to drive transition. Ongoing planned activities are as follows: • Development of advanced dual-use multi-chip packages (MCPs) and DoW requirement-driven chiplets • Lower barriers between DIB and high-volume commercial technologies to enable faster and lower cost prototyping of custom chiplets and MCPs • Develop prototypes using ITAR compliant production-ready…
FY2025 accomplishments Continue the establishment of, and accelerate access to, SOTA packaging and test facilities capable of packaging, testing and personalization of integrated circuits in which the fully assembled and operationally functional Multi-Chip Package (MCP) can contain ITAR regulated and/or classified information. Continue to ensure reuse and standardization for sustainability and costs. Continue executing transition strategy through engagement with programs offices and DIB, data driven analyses, and risk reduction. Continue to expand and accelerate the development of: • Advanced packaging capability utilizing re-shored commercial manufacturing, assembly, domestically sourced materials, and test for…