Project 911
$108.5MFY2027 request ▼ 42%DOW Unique Needs RADHARD
FY2025 actual$125.0M
FY2026 enacted$187.3M
FY2027 request$108.5M
Product Development
FY2027 Request
$156.7M
▼ 71% vs FY2026
House mark
$159.2M
▼ $2.5M vs request
FY2026 Enacted
$549.2M
In law
Roll-up of 6 projects. Projects are the summable leaves — the PE total is their sum, never added to it.
For fiscal year 2027, Defense-Wide agencies are requesting $156.7M for Trusted and Assured Microelectronics under RDT&E program element 0604294D8Z, down 71% from FY2026. In the FY2027 defense authorization, House moved to raise it to $159.2M.
Funding trajectory
Funding profile, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure.
Actual Enacted Request Outyear (FYDP)
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 788.3 |
| FY2026 | Enacted | 549.2 |
| FY2027 | Request | 156.7 |
| FY2028 | Outyear | 153.9 |
| FY2029 | Outyear | 154.3 |
| FY2030 | Outyear | 151.5 |
| FY2031 | Outyear | 151.4 |
Where it sits
Acquisition lifecycle
This program is funded in RDT&E Budget Activity 4 — Advanced Component Development & Prototypes.
Complete
Research
BA 1–2
Complete
Advanced Technology
BA 3
Current
Prototyping
BA 4
Later
Development & Fielding
BA 5–7
Inside the program element
6 projects roll up into PE 0604294D8Z
Projects are the summable leaves — the PE total is their sum, never added to it. Program elements and projects carry the full five-year plan; activities stop at the budget year. This PE moves -71% overall, which can hide much larger swings below.
Project 912
$25.6MFY2027 request ▼ 82%ME U.S. ME Dominance-Dev
FY2025 actual$140.0M
FY2026 enacted$139.5M
FY2027 request$25.6M
Product Development
Project 907
$14.9MFY2027 request ▼ 88%Access to State-of-the-Art (SOTA) Microelectronics - Development
FY2025 actual$311.8M
FY2026 enacted$125.0M
FY2027 request$14.9M
Product Development
Project 908
$7.7MFY2027 request ▼ 92%Access to Advanced Packaging and Testing - Development
FY2025 actual$53.0M
FY2026 enacted$97.3M
FY2027 request$7.7M
Product Development
Project 271
$0.0MFY2027 request Software Assurance
FY2025 actual$8.5M
FY2026 enacted$0.0M
FY2027 request$0.0M
Product Development
Project 294
$0.0MFY2027 request Classified Microelectronics Project
FY2025 actual$150.0M
FY2026 enacted$0.0M
FY2027 request$0.0M
Product Development
The whole program
SOTA is funded on 2 lines across 1 appropriations
This page shows $14.9M of SOTA, 88% of the program's $16.9M FY2027 request. The rest is appropriated elsewhere.
| Also funded here | Type | Component | FY2027 $M |
|---|---|---|---|
| Access to State-of-the-Art (SOTA) Microelectronics - Demonstration | RDT&E | Defense-Wide | 2.1 |
| SOTA total | Defense-Wide | 16.9 |
Lines whose title names the program. 6 further lines only mention SOTA in their justification text — those fund something else and are deliberately excluded from the total.
Congressional action
The request is contested
Committee marks on the FY2027 request. Adds and cuts are reconciled in conference before they become law.
RequestPresident's Budget
$156.7M
House NDAA (HASC)HASC
$159.2M +$2.5M · +1.6%
Senate NDAA (SASC)SASC
$506.7M +$350.0M · +223%
House Approps (HAC-D)HAC_D
$269.4M +$112.7M · +72%
▲ $347.5M chamber gap — unresolved as of 2026-07-27. These are FY2027 authorization marks (NDAA); appropriations and the conference agreement may differ.
Who's building it
Where the FY2027 request goes
Performers named in the R-3 exhibit, resolved into industry, government-lab, and unspecified shares. Budget-justification contract funding, not obligations.
| Where FY2027 funding flows | Share | $M |
|---|---|---|
| Government labs & warfare centers | 100% | 156.7 |
| FY2027 request | 100% | 156.7 |
Program detail
Mission & acquisition strategy
This program provides microelectronics development and prototyping activities that support the 2026 National Defense Strategy Line of Effort to supercharge the United States Defense Industrial Base through building out capacity, empowering innovators and adopting new advancements in technology, guided by the Department’s policy on Assured Access to Trusted Microelectronics, and 10 USC 4128, Joint Federated Assurance Center. Microelectronics and their supporting supply chains face unprecedented and constantly changing and evolving security risks that threaten national security and the performance of Department of War (DoW) systems and technologies.
N/A
Project 911, 912, 907, 908, 271, 294 — DOW Unique Needs RADHARD
- Product Development
Ask Hitch
Ask this program element
Answers are generated from the figures on this page — the FY2027 justification exhibits and the marks tracked above — and nothing else is consulted. Confirm any figure against the cited exhibit before you use it externally.
H
Questions this page can answer
How does the FY2027 request compare with FY2026, and what does the five-year plan show?What did House do to this request, and what is still unresolved?Which project inside PE 0604294D8Z is growing fastest, and which is shrinking?How is the FY2027 request split between industry and government performers?
This page carries the budget justification and the NDAA marks — nothing else. For what a contractor has actually been obligated, the ledger is at hitchintel.com/vendors; for live solicitations, hitchintel.com/opportunities. Both are member surfaces.
Provenance
Cite this page
Sources
FY2027 Office of the Secretary of Defense RDT&E Budget Justification · Exhibits R-2 / R-3 · PE 0604294D8Z (President's Budget PB2027) — and FY2027 NDAA committee marks, as tracked 2026-07-27.
Suggested citation
HitchAI, "Trusted and Assured Microelectronics (PE 0604294D8Z)," federal budget intelligence, PB2027 vintage. hitchintel.com/programs/0604294D8Z
Machine access
Markdown twin
/programs/0604294D8Z.md · MCP mcp.hitchintel.com → budget_get_program_element, budget_get_cong_marksFY2027 Request
$108.5M
▼ 42% vs FY2026
FY2026 Enacted
$187.3M
▲ 50% vs FY2025
FY2025 Actual
$125.0M
Prior year
DOW Unique Needs RADHARD — one RDT&E project inside PE 0604294D8Z. Congressional marks are recorded on the program element, not on a project.
Project 911 — DOW Unique Needs RADHARD — requests $108.5M in FY2027, 69% of the $156.7M requested for program element 0604294D8Z. Year over year it falls 42% against FY2026.
Funding trajectory
Project 911 funding, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure. Projects carry the full five-year plan; the activities inside them stop at the budget year.
Actual Enacted Request Outyear (FYDP)
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 125.0 |
| FY2026 | Enacted | 187.3 |
| FY2027 | Request | 108.5 |
| FY2028 | Outyear | 99.8 |
| FY2029 | Outyear | 97.1 |
| FY2030 | Outyear | 91.6 |
| FY2031 | Outyear | 91.5 |
Inside the project
1 accomplishment / planned program
The R-2A exhibit. Activities carry the prior, current and budget year only — no five-year plan — and they are descriptive: coverage is partial and they do not always add back to the project, so count them, never total them. Opening lines only here — the full year-by-year narrative is on the project page.
FY2025 actual$125.0M
FY2026 enacted$187.3M
FY2027 request$108.5M
• Fabrication, test, and evaluation of radiation hardened devices and GaN materials. • Demonstrate device performance for transition. • Qualification of radiation hardened foundry processes.
Read the FY2027 plan →Project detail
What project 911 buys
The DoW relies on a small number of specialty suppliers to develop and acquire the application specific integrated circuits (ASICs) and specialized or modified commercial components required to satisfy military needs for radiation hardened digital and analog microelectronics. By partnering in the maturation of SOTA material sources, foundries, and packaging facilities, the DoW is aligning commercial practices with unique needs for performance and functionality and encouraging open access design to stimulate innovation and drive affordability. Expanding the manufacturing capability and capacity of facilities for fabrication, packaging, and testing are all enablers to ensuring availability of radiation hardened microelectronics.
R-3 lines of work
- Product Development
FY2027 Request
$25.6M
▼ 82% vs FY2026
FY2026 Enacted
$139.5M
▼ 0.3% vs FY2025
FY2025 Actual
$140.0M
Prior year
ME U.S. ME Dominance-Dev — one RDT&E project inside PE 0604294D8Z. Congressional marks are recorded on the program element, not on a project.
Project 912 — ME U.S. ME Dominance-Dev — requests $25.6M in FY2027, 16% of the $156.7M requested for program element 0604294D8Z. Year over year it falls 82% against FY2026.
Funding trajectory
Project 912 funding, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure. Projects carry the full five-year plan; the activities inside them stop at the budget year.
Actual Enacted Request Outyear (FYDP)
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 140.0 |
| FY2026 | Enacted | 139.5 |
| FY2027 | Request | 25.6 |
| FY2028 | Outyear | 29.2 |
| FY2029 | Outyear | 30.9 |
| FY2030 | Outyear | 32.2 |
| FY2031 | Outyear | 32.2 |
Inside the project
1 accomplishment / planned program
The R-2A exhibit. Activities carry the prior, current and budget year only — no five-year plan — and they are descriptive: coverage is partial and they do not always add back to the project, so count them, never total them. Opening lines only here — the full year-by-year narrative is on the project page.
FY2025 actual$140.0M
FY2026 enacted$139.5M
FY2027 request$25.6M
Conduct vulnerability analyses of intellectual property, conduct hardware assessments, integrated circuit verification and validation analyses. Conduct microelectronics situational awareness activities. Develop toolkits and establish transitions for developed toolkits for supply chain vulnerability awareness and bitstream analysis.
Read the FY2027 plan →Project detail
What project 912 buys
This project promotes microelectronics innovation and creates an evidence-based assured microelectronics pipeline and strategic partnerships for assuring field programmable gate array (FPGA) devices, supply chain awareness and security, and workforce development. It will strengthen workforce expertise and ensure DoW has access to the next generation of advanced technology by utilizing an evidence-based assurance approach. This approach enables management of microelectronics security that is commensurate with program risk throughout the product pipeline and maintain the United States as the global source for high-end, secure, and reliable microelectronics components. In addition, this project will develop new data driven risk-based assurance methodologies for supply chain protection to strengthen security while improving access, without exposing sensitive intellectual property (IP) to the foundry and requiring post-manufacture validation of foundry products. The project will develop evidence-based assured design concepts in manufactured systems, enabling a formal risk-based approach to protection techniques.
R-3 lines of work
- Product Development
FY2027 Request
$14.9M
▼ 88% vs FY2026
FY2026 Enacted
$125.0M
▼ 60% vs FY2025
FY2025 Actual
$311.8M
Prior year
Access to State-of-the-Art (SOTA) Microelectronics - Development — one RDT&E project inside PE 0604294D8Z. Congressional marks are recorded on the program element, not on a project.
Project 907 — Access to State-of-the-Art (SOTA) Microelectronics - Development — requests $14.9M in FY2027, 9.5% of the $156.7M requested for program element 0604294D8Z. Year over year it falls 88% against FY2026.
Funding trajectory
Project 907 funding, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure. Projects carry the full five-year plan; the activities inside them stop at the budget year.
Actual Enacted Request Outyear (FYDP)
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 311.8 |
| FY2026 | Enacted | 125.0 |
| FY2027 | Request | 14.9 |
| FY2028 | Outyear | 15.5 |
| FY2029 | Outyear | 15.7 |
| FY2030 | Outyear | 16.0 |
| FY2031 | Outyear | 16.0 |
Inside the project
2 accomplishments / planned programs
The R-2A exhibit. Activities carry the prior, current and budget year only — no five-year plan — and they are descriptive: coverage is partial and they do not always add back to the project, so count them, never total them. Opening lines only here — the full year-by-year narrative is on the project page.
Joint Federated Assurance Center (JFAC)▲ 5%
FY2025 actual—
FY2026 enacted$9.1M
FY2027 request$9.5M
Evaluate state-of-the-art software assurance (SwA) tools applicable to DoW needs for enhanced microelectronics software assurance; conduct an assessment of formal methods as applied to specific DoW SwA needs; advance technology for detection of malicious and subverted code in DoW embedded systems and evaluate against ground truth; map…
Access to State-of-the-Art (SOTA) Microelectronics - Development▼ 95%
FY2025 actual$311.8M
FY2026 enacted$115.9M
FY2027 request$5.4M
Focus the scope of SOTA Access efforts to deliver end-to-end design, tape out, test and evaluation for specific chips in concert with transition partners. These efforts include application specific integrated circuits (ASICs) for communications and imaging applications.
Project detail
What project 907 buys
This project establishes strategic partnerships with commercial SOTA domestic foundries to develop a data-driven, risk- based approaches to supply chain protection and develops the assured access, secure design, and manufacturing capability of advanced microelectronics technology and electronic components. This project funds microelectronics software assurance (SwA) support to DoW programs and supports the activities of the Joint Federated Assurance Center (JFAC), codified in the National Defense Authorization Act (NDAA) for Fiscal Year 2025, Sec 922, to support the assurance needs of the DoW by ensuring, pursuant to policies related to hardware and software assurance and supply chain risk management, that the software and hardware developed, acquired, maintained, and used by the Department are free from intentional and unintentional vulnerability during the life-cycle of development and deployment of assured, trustworthy defense systems. Projects are transitioning technologies into DoW systems and platforms, ensuring access to multiple onshore commercial microelectronics facilities, establishing secure design capabilities, implementing an evidence-based approach to supply chain protection, and developing technologies for situational awareness of the global microelectronics supply chain. This project builds the foundation for updating and strengthening DoW assurance methods and standards with industry to develop data driven evidence-based practices.
R-3 lines of work
- Product Development
FY2027 Request
$7.7M
▼ 92% vs FY2026
FY2026 Enacted
$97.3M
▲ 84% vs FY2025
FY2025 Actual
$53.0M
Prior year
Access to Advanced Packaging and Testing - Development — one RDT&E project inside PE 0604294D8Z. Congressional marks are recorded on the program element, not on a project.
Project 908 — Access to Advanced Packaging and Testing - Development — requests $7.7M in FY2027, 4.9% of the $156.7M requested for program element 0604294D8Z. Year over year it falls 92% against FY2026.
Funding trajectory
Project 908 funding, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure. Projects carry the full five-year plan; the activities inside them stop at the budget year.
Actual Enacted Request Outyear (FYDP)
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 53.0 |
| FY2026 | Enacted | 97.3 |
| FY2027 | Request | 7.7 |
| FY2028 | Outyear | 9.4 |
| FY2029 | Outyear | 10.6 |
| FY2030 | Outyear | 11.6 |
| FY2031 | Outyear | 11.6 |
Inside the project
1 accomplishment / planned program
The R-2A exhibit. Activities carry the prior, current and budget year only — no five-year plan — and they are descriptive: coverage is partial and they do not always add back to the project, so count them, never total them. Opening lines only here — the full year-by-year narrative is on the project page.
Access to Advanced Packaging and Testing - Development▼ 92%
FY2025 actual$53.0M
FY2026 enacted$97.3M
FY2027 request$7.7M
• Focus on advanced packaging technology for digital, analog, and mixed-signal applications for DoW transition partners. • Test, evaluate, and analyze MCP solutions for transition to DoW systems.
Project detail
What project 908 buys
Advanced packaging provides necessary performance improvements, size, weight, power, and cost (SWAP-C) benefits, and unique opportunities to disaggregate DoW requirements into smaller and lower cost chiplets while maximally leveraging SOTA commercial technologies. However, domestic advanced packaging capabilities are limited and the heterogeneous integrated (HI) chiplet ecosystem is nascent. This project is a collaborative effort among the DoW, the Defense Industrial Base (DIB), and domestic commercial industry to leverage and enhance existing capabilities to develop self-sustaining advanced packaging and test solutions that meet DoW needs.
R-3 lines of work
- Product Development
FY2027 Request
$0.0M
No FY2026 funding
FY2026 Enacted
$0.0M
▼ 100% vs FY2025
FY2025 Actual
$8.5M
Prior year
Software Assurance — one RDT&E project inside PE 0604294D8Z. Congressional marks are recorded on the program element, not on a project.
Project 271 — Software Assurance — requests $0.0M in FY2027, 0.0% of the $156.7M requested for program element 0604294D8Z.
Funding trajectory
Project 271 funding, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure. Projects carry the full five-year plan; the activities inside them stop at the budget year.
Actual Enacted Request Outyear (FYDP)
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 8.5 |
| FY2026 | Enacted | 0.0 |
| FY2027 | Request | 0.0 |
| FY2028 | Outyear | 0.0 |
| FY2029 | Outyear | 0.0 |
| FY2030 | Outyear | 0.0 |
| FY2031 | Outyear | 0.0 |
Inside the project
1 accomplishment / planned program
The R-2A exhibit. Activities carry the prior, current and budget year only — no five-year plan — and they are descriptive: coverage is partial and they do not always add back to the project, so count them, never total them.
Joint Federated Assurance Center (JFAC)
FY2025 actual$8.5M
FY2026 enacted—
FY2027 request—
Project detail
What project 271 buys
This project funds microelectronics software assurance (SwA) support to DoW programs and supports the activities of the Joint Federated Assurance Center (JFAC), codified in the National Defense Authorization Act (NDAA) for Fiscal Year 2025, Sec 922, to support the assurance needs of the DoW by ensuring, pursuant to policies related to hardware and software assurance and supply chain risk management, that the software and hardware developed, acquired, maintained, and used by the Department are free from intentional and unintentional vulnerability during the life-cycle of development and deployment of assured, trustworthy defense systems.
R-3 lines of work
- Product Development
FY2027 Request
$0.0M
No FY2026 funding
FY2026 Enacted
$0.0M
▼ 100% vs FY2025
FY2025 Actual
$150.0M
Prior year
Classified Microelectronics Project — one RDT&E project inside PE 0604294D8Z. Congressional marks are recorded on the program element, not on a project.
Project 294 — Classified Microelectronics Project — requests $0.0M in FY2027, 0.0% of the $156.7M requested for program element 0604294D8Z.
Funding trajectory
Project 294 funding, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure. Projects carry the full five-year plan; the activities inside them stop at the budget year.
Actual Enacted Request Outyear (FYDP)
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 150.0 |
| FY2026 | Enacted | 0.0 |
| FY2027 | Request | 0.0 |
| FY2028 | Outyear | 0.0 |
| FY2029 | Outyear | 0.0 |
| FY2030 | Outyear | 0.0 |
| FY2031 | Outyear | 0.0 |
Inside the project
1 accomplishment / planned program
The R-2A exhibit. Activities carry the prior, current and budget year only — no five-year plan — and they are descriptive: coverage is partial and they do not always add back to the project, so count them, never total them.
Classified Microelectronics Project
FY2025 actual$150.0M
FY2026 enacted—
FY2027 request—
Project detail
What project 294 buys
Classified Microelectronics Project
R-3 lines of work
- Product Development