What project 911 buys
The DoW relies on a small number of specialty suppliers to develop and acquire the application specific integrated circuits (ASICs) and specialized or modified commercial components required to satisfy military needs for radiation hardened digital and analog microelectronics. By partnering in the maturation of SOTA material sources, foundries, and packaging facilities, the DoW is aligning commercial practices with unique needs for performance and functionality and encouraging open access design to stimulate innovation and drive affordability. Expanding the manufacturing capability and capacity of facilities for fabrication, packaging, and testing are all enablers to ensuring availability of radiation hardened microelectronics.
- Product Development
Project 911 funding, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure. Projects carry the full five-year plan; the activities inside them stop at the budget year.
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 125.0 |
| FY2026 | Enacted | 187.3 |
| FY2027 | Request | 108.5 |
| FY2028 | Outyear | 99.8 |
| FY2029 | Outyear | 97.1 |
| FY2030 | Outyear | 91.6 |
| FY2031 | Outyear | 91.5 |
1 accomplishment / planned program
The R-2A exhibit — the only level of the budget that describes work that has not happened yet. Activities carry the prior, current and budget year only, no five-year plan. Each describes FY2027 work in enough detail to have its own page; the rest are shown here in full. Coverage is partial across the corpus, so count activities, never total them.
• Fabrication, test, and evaluation of radiation hardened devices and GaN materials. • Demonstrate device performance for transition. • Qualification of radiation hardened foundry processes.
Read the FY2027 plan →