What the FY2027 request buys
Verbatim from the R-2A exhibit for project 621010 of PE 1206601SF. This is the budget justification's own description of work that has not happened yet — the one thing no other level of the budget carries.
Continue: -Development of Strategic Radiation Hardened (SRH) Non-Volatile Memory (NVM) to address the electrical and radiation performance requirements gap identified in Strategic Radiation Hardened Electronics Council's (SRHEC) Program Needs Report #4. -Technology development to ensure durability of a domestic source of Readout Integrated Circuits (ROIC) and Focal Plane Array (FPA) technologies. -Technology development to enable maturation of large format, high- dynamic range FPAs. -Feasibility assessment to port radiation hardened ROIC technology from current State-of-the-Art to a more advanced processing node. Complete: -Fabrication of sub-scale test articles and evaluation of test chips to reduce program risk and ensure the full-scale prototype is on track to meet radiation and performance requirements. Commence: - Qualified Manufactures List (QML) flight qualification testing of prototype SRH NVM - Design, prototype and manufacturing of radiation-hardened high-performance SRH NVM architecture and fabrication of a high- density variant.
FY 2027 decreased compared to FY 2026 by $0.795 million due to program maturation and flow of deliverables.
FY2026: the year under way
Prior-year accomplishments and current-year plans from the same exhibit. Context for the FY2027 plan, not a series — an activity partitions its project exactly in the request year, but can under-cover it in earlier years.
Continue: -Development of Strategic Radiation Hardened (SRH) Non-Volatile Memory (NVM) to address the electrical and radiation performance requirements gap identified in Strategic Radiation Hardened Electronics Council's (SRHEC) Program Needs Report #4. -Technology development to ensure durability of a domestic source of readout integrated circuits (ROIC) and focal plane array (FPA) technologies. -Technology development to enable maturation of large format, high- dynamic range FPAs. -Feasibility assessment to port radiation hardened ROIC technology from current State-of-the-Art to a more advanced processing node. -Fabrication of sub-scale test articles and evaluation of test chips to reduce program risk and ensure the full-scale prototype is on track to meet radiation and performance requirements. Complete: -SRH NVM Critical Design Review (CDR) and begin hardware prototyping. -Reporting of alternative science and technology approach and development of a risk feasibility report.
Three years, and no five-year plan
An R-2A activity publishes the prior year, the current year and the budget year. The FYDP outyears exist at project and program-element level and are deliberately absent here rather than inferred. Estimate types are colored and never summed into one figure.
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 11.0 |
| FY2026 | Enacted | 12.6 |
| FY2027 | Request | 11.8 |
This activity is 40% of project 621010's FY2027 request and 5.0% of PE 1206601SF's. In the request year the activities under a project sum to it exactly; in the current year they under-cover it in about 9% of cases, so an activity's delta can legitimately exceed its parent's and the two must not be compared row to row.
2 activities in project 621010
Every R-2A line of this project, largest FY2027 request first. Linked where the activity has enough of its own narrative to carry a page; the rest are shown in full on the project page.