RDT&E Program Element · President's Budget PB2027

Microelectronics Commons - 0403D

PE 0602669D8Z·Defense-Wide·Approp. 0403D — RDT&E·BA2 — Applied Research
FY2027 Request
$73.0M
⚑ Contested — Senate adds 69%
HitchAI read

Defense-Wide requests $73.0M in FY2027 (down from a FY2026 peak), with nothing planned by FY2031. In the FY2027 defense authorization, the Senate added 69% (to $50.0M).

FY2027 Request
$73.0M
▼ 8.4% vs FY2026
Senate mark
$50.0M
▼ $50.0M vs request
FY2026 Enacted
$79.7M
In law

For fiscal year 2027, Defense-Wide agencies are requesting $73.0M for Microelectronics Commons - 0403D under RDT&E program element 0602669D8Z, down 8.4% from FY2026. In the FY2027 defense authorization, Senate moved to raise it to $50.0M.

Funding trajectory

Funding profile, FY2025–FY2031

Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure.

25507500.0FY25ACTUAL79.7FY26ENACTED73.0FY27REQUEST0.0FY280.0FY290.0FY300.0FY31SENATE
Actual Enacted Request Outyear (FYDP) Senate mark
Fiscal YearEstimate TypeAmount ($M)
FY2025Actual0.0
FY2026Enacted79.7
FY2027Request73.0
FY2028Outyear0.0
FY2029Outyear0.0
FY2030Outyear0.0
FY2031Outyear0.0
Where it sits

Acquisition lifecycle

This program is funded in RDT&E Budget Activity 2 — Applied Research.

Current
Research
BA 1–2
Later
Advanced Technology
BA 3
Later
Prototyping
BA 4
Later
Development & Fielding
BA 5–7
Inside the program element

1 project rolls up into PE 0602669D8Z

Projects are the summable leaves — the PE total is their sum, never added to it. Program elements and projects carry the full five-year plan; activities stop at the budget year. This PE moves -8% overall, which can hide much larger swings below.

Project 825

Microelectronics Research Maturation-Development

$73.0MFY2027 request ▼ 8%
FY2025 actual
FY2026 enacted$79.7M
FY2027 request$73.0M

This project focuses on the applied research activities of the Commons including the early research and development of new microelectronics materials, processes, devices, and architectural designs. It seeks to answer how new models, science, and technology can be leveraged to create a different manufacturing paradigm based on proven process tools in agile microelectronics fabrication facilities (fabs). The project also supports the establishment of the Commons Hubs, which will be networks of regional capabilities organized in collaboration with the Commons Consortium Manager (CM) to address DoW and commercial needs and requirements. The Hubs may include existing facilities augmented to enhance intrinsic specializations in emerging areas of microelectronics. Each Hub will concentrate on one of six technical areas including: Secure Edge Computing, 5G/6G Technology, Artificial Intelligence Hardware, Quantum Technology, Electromagnetic Warfare, and Commercial Leap Ahead Technologies. Core Facilities (i.e., fabs) are integral parts of the Hubs network that will provide key fabrication capabilities that are required to demonstrate prototypes with the volume and characteristics required to ensure reduced risk for full manufacturing production. Additionally, the project will directly support early workforce development activities through the Commons network. Activities may span K-12, undergraduate, graduate and continuing education and may include, for example, establishment of PhD internships and post-doc training at Hub facilities and internships with Hub members.

Accomplishments / planned programs (R-2A) — prior, current and budget year only
FY2025 actual
FY2026 enacted$79.7M
FY2027 request$73.0M

• Complete selection of Hub projects for execution; complete execution of existing Hub projects; prototyping new microelectronics technologies for DOW and dual-use applications • Execution of Hub operations to enable DOW access to prototyping capabilities and development of the semiconductor talent pipeline. • Transition of Hub projects…

Read the FY2027 plan →
Congressional action

The request is contested

Committee marks on the FY2027 request. Adds and cuts are reconciled in conference before they become law.

RequestPresident's Budget
$73.0M
Senate NDAA (SASC)SASC
$50.0M +$50.0M · +69%
unresolved as of 2026-07-27. These are FY2027 authorization marks (NDAA); appropriations and the conference agreement may differ.
Program detail

Mission & acquisition strategy

This Program supports the Department's initiatives to Build Sustainable and Long-Term Advantage, Defend the Homeland, and Deter Aggression. The Office of the Under Secretary of War for Research and Engineering (OUSW(R&E)) is executing the Microelectronics Commons (the Commons) activity pursuant to the Fiscal Year (FY) 2021 National Defense Authorization Act (NDAA) (Pub. L. 116-283), including and funded through the CHIPS for America Defense Fund established by the CHIPS Act of 2022. The FY 2021 NDAA legislation significantly emphasizes solutions that promote the domestic on-shoring of capabilities to address economic and technology security concerns. Under FY 2021 NDAA Sec.

Project 825 — Microelectronics Research Maturation-Development
Ask Hitch

Ask this program element

Answers are generated from the figures on this page — the FY2027 justification exhibits and the marks tracked above — and nothing else is consulted. Confirm any figure against the cited exhibit before you use it externally.

H
Questions this page can answer
How does the FY2027 request compare with FY2026, and what does the five-year plan show?What did Senate do to this request, and what is still unresolved?In plain terms, what is this program element for and how is it being acquired?

This page carries the budget justification and the NDAA marks — nothing else. For what a contractor has actually been obligated, the ledger is at hitchintel.com/vendors; for live solicitations, hitchintel.com/opportunities. Both are member surfaces.

Provenance

Cite this page

Sources
FY2027 Office of the Secretary of Defense RDT&E Budget Justification · Exhibits R-2 / R-3 · PE 0602669D8Z (President's Budget PB2027) — and FY2027 NDAA committee marks, as tracked 2026-07-27.
Suggested citation
HitchAI, "Microelectronics Commons - 0403D (PE 0602669D8Z)," federal budget intelligence, PB2027 vintage. hitchintel.com/programs/0602669D8Z
Machine access
Markdown twin /programs/0602669D8Z.md · MCP mcp.hitchintel.combudget_get_program_element, budget_get_cong_marks