RDT&E Program Element · President's Budget PB2027

Microelectronics Commons - 0403D

PE 0604669D8Z·Defense-Wide·Approp. 0403D — RDT&E·BA4 — Advanced Component Development & Prototypes
FY2027 Request
$62.4M
◆ Development crest → decline
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Defense-Wide requests $62.4M in FY2027 — the program's peak, with nothing planned by FY2031.

FY2027 Request
$62.4M
▲ 4.7% vs FY2026
FY2026 Enacted
$59.6M
No FY2025 funding
FY2025 Actual
$0.0M
Prior year

For fiscal year 2027, Defense-Wide agencies are requesting $62.4M for Microelectronics Commons - 0403D under RDT&E program element 0604669D8Z, up 4.7% over FY2026.

Funding trajectory

Funding profile, FY2025–FY2031

Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure.

255000.0FY25ACTUAL59.6FY26ENACTED62.4FY27REQUEST0.0FY280.0FY290.0FY300.0FY31
Actual Enacted Request Outyear (FYDP)
Fiscal YearEstimate TypeAmount ($M)
FY2025Actual0.0
FY2026Enacted59.6
FY2027Request62.4
FY2028Outyear0.0
FY2029Outyear0.0
FY2030Outyear0.0
FY2031Outyear0.0
Where it sits

Acquisition lifecycle

This program is funded in RDT&E Budget Activity 4 — Advanced Component Development & Prototypes.

Complete
Research
BA 1–2
Complete
Advanced Technology
BA 3
Current
Prototyping
BA 4
Later
Development & Fielding
BA 5–7
Inside the program element

1 project rolls up into PE 0604669D8Z

Projects are the summable leaves — the PE total is their sum, never added to it. Program elements and projects carry the full five-year plan; activities stop at the budget year. This PE moves 5% overall, which can hide much larger swings below.

Project 832

Microelectronics Research Maturation – Advanced Prototyping

$62.4MFY2027 request ▲ 5%
FY2025 actual
FY2026 enacted$59.6M
FY2027 request$62.4M
Product Development

This project focuses on advanced prototyping activities of the Commons. Additionally, it focuses on providing cost-effective ways to capture and incentivize domestic R&D for various semiconductor technologies in a low-volume production environment and transition them for DoW and commercial market applications. Specifically, it works to transition developments from Commons Hubs resulting from technology identification and research funded by Commons PEs 0602669D8Z and matured by activities funded by Commons PE 0603669D8Z. The project also supports the establishment of the Commons Hubs, which will be networks of regional capabilities organized in collaboration with the CM to address DoW and commercial needs and requirements. The Hubs may include existing academic facilities augmented to enhance intrinsic specializations in emerging areas of microelectronics. Each Hub will concentrate on one of six technical areas including: Secure Edge Computing, 5G/6G Technology, Artificial Intelligence Hardware, Quantum Technology, Electromagnetic Warfare, and Commercial Leap Ahead Technologies. Core Facilities (i.e., fabs) are integral parts of the Hubs network which will provide key fabrication capabilities that are required to demonstrate prototypes with the volume and characteristics required to ensure reduced risk for full manufacturing production.

Accomplishments / planned programs (R-2A) — prior, current and budget year only
FY2025 actual
FY2026 enacted$59.6M
FY2027 request$62.4M

• Complete selection of Hub projects for execution; complete execution of existing Hub projects; prototyping new microelectronics technologies for DoW and dual-use applications • Execution of Hub operations to enable DoW access to prototyping capabilities and development of the semiconductor talent pipeline. • Transition of Hub projects…

Read the FY2027 plan →
Who's building it

Where the FY2027 request goes

Performers named in the R-3 exhibit, resolved into industry, government-lab, and unspecified shares. Budget-justification contract funding, not obligations.

Where FY2027 funding flowsShare$M
Other / unspecified100%62.4
FY2027 request100%62.4
Program detail

Mission & acquisition strategy

This Program supports the Department's initiatives to Build Sustainable and Long-Term Advantage, Defend the Homeland, and Deter Aggression. The Office of the Under Secretary of War for Research and Engineering (OUSW(R&E)) is executing the Microelectronics Commons (the Commons) activity pursuant to the Fiscal Year (FY) 2021 National Defense Authorization Act (NDAA) (Pub. L. 116-283), including and funded through the CHIPS for America Defense Fund established by the CHIPS Act of 2022. The FY 2021 NDAA legislation significantly emphasizes solutions that promote the domestic on-shoring of capabilities to address economic and technology security concerns. Under FY 2021 NDAA Sec.

N/A

Project 832 — Microelectronics Research Maturation – Advanced Prototyping
  • Product Development
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Answers are generated from the figures on this page — the FY2027 justification exhibits and the marks tracked above — and nothing else is consulted. Confirm any figure against the cited exhibit before you use it externally.

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Questions this page can answer
How does the FY2027 request compare with FY2026, and what does the five-year plan show?How is the FY2027 request split between industry and government performers?In plain terms, what is this program element for and how is it being acquired?

This page carries the budget justification and the NDAA marks — nothing else. For what a contractor has actually been obligated, the ledger is at hitchintel.com/vendors; for live solicitations, hitchintel.com/opportunities. Both are member surfaces.

Provenance

Cite this page

Sources
FY2027 Office of the Secretary of Defense RDT&E Budget Justification · Exhibits R-2 / R-3 · PE 0604669D8Z (President's Budget PB2027).
Suggested citation
HitchAI, "Microelectronics Commons - 0403D (PE 0604669D8Z)," federal budget intelligence, PB2027 vintage. hitchintel.com/programs/0604669D8Z
Machine access
Markdown twin /programs/0604669D8Z.md · MCP mcp.hitchintel.combudget_get_program_element