Roll-up of 2 projects. Projects are the summable leaves — the PE total is their sum, never added to it.
For fiscal year 2027, Defense-Wide agencies are requesting $0.0M for Electronics Technology under RDT&E program element 0602716E, against nothing enacted in FY2026.
Funding profile, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure.
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 621.1 |
| FY2026 | Enacted | 0.0 |
| FY2027 | Request | 0.0 |
| FY2028 | Outyear | 0.0 |
| FY2029 | Outyear | 0.0 |
| FY2030 | Outyear | 0.0 |
| FY2031 | Outyear | 0.0 |
Acquisition lifecycle
This program is funded in RDT&E Budget Activity 2 — Applied Research.
2 projects roll up into PE 0602716E
Projects are the summable leaves — the PE total is their sum, never added to it. Program elements and projects carry the full five-year plan; activities stop at the budget year.
BEYOND SCALING TECHNOLOGY
Mission & acquisition strategy
The efforts described in this Program Element (PE) address the Applied Research associated with the Electronics Technology Program that is directed towards developing electronics that make a wide range of military applications possible. The PE focuses on turning basic advancements into the underpinning technologies required to address critical national security issues and to enable an information-driven warfighter. This PE also supports innovation and robust transition planning in the technology cycle by working with entrepreneurs to increase the likelihood that DARPA funded technologies take root in the U.S. and provide new capabilities for national defense.
Ask this program element
Answers are generated from the figures on this page — the FY2027 justification exhibits and the marks tracked above — and nothing else is consulted. Confirm any figure against the cited exhibit before you use it externally.
This page carries the budget justification and the NDAA marks — nothing else. For what a contractor has actually been obligated, the ledger is at hitchintel.com/vendors; for live solicitations, hitchintel.com/opportunities. Both are member surfaces.
Cite this page
ELECTRONIC TECHNOLOGY — one RDT&E project inside PE 0602716E. Congressional marks are recorded on the program element, not on a project.
Project ELT-01 — ELECTRONIC TECHNOLOGY — requests $0.0M in FY2027.
Project ELT-01 funding, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure. Projects carry the full five-year plan; the activities inside them stop at the budget year.
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 100.4 |
| FY2026 | Enacted | 0.0 |
| FY2027 | Request | 0.0 |
| FY2028 | Outyear | 0.0 |
| FY2029 | Outyear | 0.0 |
| FY2030 | Outyear | 0.0 |
| FY2031 | Outyear | 0.0 |
11 accomplishments / planned programs
The R-2A exhibit. Activities carry the prior, current and budget year only — no five-year plan — and they are descriptive: coverage is partial and they do not always add back to the project, so count them, never total them.
FY2025 accomplishments - Achieved system performance and capacity metrics. - Executed field test and characterized performance.
FY2025 accomplishments - Began development of design for analog hardware at medium scales. - Began development of analog feature extraction and classification techniques at medium scales. - Began development of inferencing and compression algorithms at medium scales. - Began development of co-design analysis of hardware and algorithms at medium scales.
FY2025 accomplishments - Initiated exploration of design architecture for achieving high velocity motion with a tethered microsystem on chip. - Investigated locking of mechanical frequency comb for shock and vibration immunity of sensors. - Performed basic surface chemistry analysis and experiments to initiate an accelerating aging study of sensors over their lifetime.
FY2025 accomplishments - Developed modeling and simulation of counter UUV techniques. - Conducted modeling of environmental constraints. - Performed benchtop testing of UUV hardware. - Demonstrated techniques in test tank.
FY2025 accomplishments - Workshopped initial boundary conditions for simulations and experiments. - Demonstrate and integrate initial set of catalysts and microsystems.
FY2025 accomplishments - Derived theory for tensor waveforms based on developments in the optical field. - Defined and developed the test systems that will be used to explore the phenomena of tensor waveform interaction with test targets. - Performed initial laboratory experiments using tensor radar waveforms to validate the theoretical models.
FY2025 accomplishments - Initiated theory developments of robust quantum sensors. - Initiated study of program of record needs and requirements for quantum sensors. - Validate program of record needs and Requirements for quantum sensors.
FY2025 accomplishments - Experimentally demonstrated broadband amplifier power, bandwidth, and pulse duration performance at low repetition rates. - Demonstrated integrated electromagnetic coupling tools that combine deterministic, reduced-model, and statistical approaches using a hybrid framework. - Validated electromagnetic coupling tools and predictive models through comparison with experimental measurements on relevant targets. - Demonstrated disruptive agile waveform techniques on integrated electronics relevant to the DoD.
FY2025 accomplishments - Conducted ROIC control demonstrations. - Performed initial full focal plane array (FPA) functionality testing. - Tested fully integrated camera for final program capability demonstration. - Demonstrated disruptive agile waveform techniques on integrated electronics relevant to the DoW.
FY2025 accomplishments - Demonstrated compact, benchtop prototype microwave synthesizers with extremely low phase noise. - Optimized the design of tunable synthesizers with output across multiple frequency bands. - Analyzed how to optimize the design of synthesizers with robustness to environmental stress.
FY2025 accomplishments - Designed further size, weight, and power (SWaP) -reduced and ruggedized tensor magnetometer with sensor fusion and automation. - Performed field test of further SWaP-reduced and ruggedized tensor magnetometer system.
What project ELT-01 buys
Advances in microelectronic device technologies continue to significantly benefit improved weapons effectiveness, intelligence capabilities, and information superiority. The Electronic Technology project supports continued advancement in microelectronics, including electronic and optoelectronic devices, Microelectromechanical Systems (MEMS), semiconductor device design and fabrication, and new materials and material structures. Areas of particular emphasis of this work include reducing the barriers to designing and fabricating custom electronics and exploiting improved manufacturing techniques to provide low-cost, high-performance sensors. Programs in this project will also greatly improve the size, weight, power, and performance characteristics of electronic systems; support positioning, navigation, and timing in GPS-denied environments; and develop sensors more sensitive and robust than today's standards. This project has six major focus areas: Electronics, Photonics, Microelectromechanical Systems, Architectures, Algorithms, and other Electronic Technology research. Beginning in FY 2026, efforts in this Project will be funded in PEs 0602025E, Project MSL-03 and 0602026E, Project EFF-01.
BEYOND SCALING TECHNOLOGY — one RDT&E project inside PE 0602716E. Congressional marks are recorded on the program element, not on a project.
Project ELT-02 — BEYOND SCALING TECHNOLOGY — requests $0.0M in FY2027.
Project ELT-02 funding, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure. Projects carry the full five-year plan; the activities inside them stop at the budget year.
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 520.7 |
| FY2026 | Enacted | 0.0 |
| FY2027 | Request | 0.0 |
| FY2028 | Outyear | 0.0 |
| FY2029 | Outyear | 0.0 |
| FY2030 | Outyear | 0.0 |
| FY2031 | Outyear | 0.0 |
26 accomplishments / planned programs
The R-2A exhibit. Activities carry the prior, current and budget year only — no five-year plan — and they are descriptive: coverage is partial and they do not always add back to the project, so count them, never total them.
FY2025 accomplishments - Performed real-world demonstrations of the approaches and tools. - Demonstrated initial viability of the approaches and tools to medium-complexity systems.
FY2025 accomplishments - Finalized design of concept test vehicle for validation of developed theory of electrically-small receiver and transmitter. - Demonstrated electrically-small receiver performance in a laboratory environment. - Demonstrated electrically-small transmitter performance in a laboratory environment.
FY2025 accomplishments - Developed 3D synthesis modeling and analysis of advanced additive manufacturing technology. - Developed high quality multi-material precursor that capable of supporting simultaneous material additive manufacturing. - Demonstrated simultaneous multi-material synthesis using advanced additive manufacturing technology.
FY2025 accomplishments - Fabricated high-performance radiation-tolerant, high-voltage transistors and compact passives. - Initiated gate drive and control circuit design for high efficiency and compact radiation tolerant POL converters.
FY2025 accomplishments - Completed fabrication process development for integrated photonics circuits that can create and manipulate quantum states of light. - Experimentally demonstrated squeezed light generation using chip-scale components. - Experimentally demonstrated components of chip-scale low-loss interferometer circuits.
FY2025 accomplishments - Refined concepts for the reduction of transistor thermal resistance. - Designed and fabricated thermal resistance test structures with a 2.5X reduction in thermal resistance. - Refined concepts for robust RF PAs with increased output power density. - Demonstrated robust transistors and PAs with a 5X increase in output power density, compared to the state-of-the-art (SOA).
FY2025 accomplishments - Refined thermal performance of developed solutions for both within stack, and outside stack. - Assembled three-tier test vehicle to demonstrate target thermal management capabilities in a laboratory. - Demonstrated operational three-tier test vehicle to meet target thermal management capabilities in a laboratory.
FY2025 accomplishments - Completed fabrication of transistor technology and pressure transducers. - Characterized performance of transistors and transducers at high temperature. - Completed design of signal conditioning circuits. - Initiated design and simulation of integrated sensor module.
FY2025 accomplishments - Maximized the energy efficiency and speed of the MCEs for improved performance. - Demonstrated a compact MAM with a high number of MCEs, showcasing scalability and potential for parallel processing.
FY2025 accomplishments - Demonstrated functionality and characterized performance of novel optomechanical IR detector devices. - Initialized fabrication, integration, and characterization of scalable optomechanical IR detectors.
FY2025 accomplishments - Developed new adaptive array processing algorithms that maintain the performance of traditional algorithms but reduce the number of computational steps while scaling more linearly as array size increases. - Designed processing elements capable of implementing the algorithms developed during SOAP and to move array processing onto the array. - Performed independent verification and validation of initial set of delivered algorithms.
FY2025 accomplishments - Developed tools and techniques for automated chain link generation in complex systems. - Characterized and modeled exploits to enable forecasting for piecewise exploit chain composition and repair. - Explored and prioritized demonstrations of exploit chain models and forecasting for systems of interest to transition partners.
FY2025 accomplishments - Achieved repeatable manufacturability of high-performance filters with low device-to-device variability. - Integrated the low insertion loss filters into filter tiles with supporting architecture. - Demonstrated capabilities of filter tiles under operationally relevant conditions.
FY2025 accomplishments - Delivered DRBE components to DoW laboratory for integration. - Validated real-time High-Performance Computer (HPC) performance with a representative DRBE workload. - Developed expanded input/output subsystem to be integrated with the DRBE HPC.
FY2025 accomplishments - Designed radiation source and initiated procurement and laboratory preparation for fabrication. - Conducted proof-of-concept experiments to validate the ability of novel sources to reproduce single-event effect responses in representative electronic devices.
FY2025 accomplishments - Increased the efficiency and output power of compact G-band III-V MMIC PAs that use the silicon-like multilayer interconnects to at or near electrical limit. - Reduced the power loss of array-level interconnects to near electrical limit for integration of G-band PAs with other array components. - Completed design, and fabricated and tested circularly-polarized, medium-power transmit and low noise receive array test articles.
FY2025 accomplishments - Developed hypotheses for long-term clock aging. - Demonstrated preliminary aging reduction techniques. - Initiated construction of fully-integrated clock.
FY2025 accomplishments - Demonstrated preliminary proof-of-concept one-dimensional test arrays of novel nanoresonator-based computing engines for high speed, energy efficient scientific computations. - Performed concept validation and preliminary benchmarking of computing accuracy, speed and power efficiency of nanoresonator computing components.
FY2025 accomplishments - Optimized UWBG material synthesis approaches to reduce defect density, improve doping efficiency and uniformity, and quantified improvements in material quality by designing, fabricating, and characterizing test structures. - Optimized the fabrication process to create robust, low-resistance electrical contacts to UWBG materials, and fabricated and characterized test structures to quantify robustness and improvement in contact resistance. - Evaluated characterization results and compared to current state-of-the-art to quantify the improvement possible with UWBG devices.
FY2025 accomplishments - Demonstrated feasibility of 3D routing in integrated photonics through modeling of photonic structures. - Designed and simulated performance of low insertion loss passive optical links with an optical path originating in the waveguide fabric of one discrete chip and terminating in the waveguide fabric of another discrete chip stacked on the initial chip.
FY2025 accomplishments - Researched the capability for learning back-end performance models for traditional processors. - Formulated an evaluation framework for compilation that is based on measures such as performance, memory size, and power consumption.
FY2025 accomplishments - Completed the set up the heterogeneous material synthesis tools. - Demonstrated nano-meter thick defect free heterogeneous semiconductor lattice mismatched synthesis on silicon substrate. - Demonstrated the grown materials have good electrical performance.
FY2025 accomplishments - Designed specifications for a quantum-network interface card (qNIC) that can send and receive quantum information. - Designed algorithms, protocols, and software infrastructure for hybrid quantum-classical optical data streams to enable the use of quantum timing and sensing information atop classical information.
FY2025 accomplishments - Incorporated device improvements and higher-complexity external designs in a second laser-enabled foundry run.
FY2025 accomplishments - Demonstrated small-scale analog subsystem hardware and validated initial hardware performance models. - Demonstrated digital resource estimation in the co-design framework.
FY2025 accomplishments - Packaged and tested the DPRIVE coprocessor microcircuit for basic operations. - Executed pre-determined workloads and benchmarks to establish performance, speed, and accuracy of the coprocessor's homomorphic encryption capabilities.
What project ELT-02 buys
The Beyond Scaling Technology project pursues electronics performance advancements that exploit new concepts in circuit specialization and three-dimensional heterogeneous integration (3DHI) by the optimization of materials, devices, architectures, and designs to achieve specific circuit function at high performance. Because electronics advancements must simultaneously make progress in performance and secure the foundation on which our microelectronics infrastructure relies, this envisioned specialization will require incorporation of security safeguards and advancing manufacturing tools and process automation. Accordingly, programs within the Beyond Scaling Technology project will reduce barriers to making specialized circuits in today's silicon hardware and 3DHI by improving producibility. This will significantly increase the ease with which DoW can design, deliver, and eventually upgrade critical, customized microelectronics, particularly for operation in extreme environments. Programs also explore alternatives to traditional circuit architectures, for instance by exploiting 3DHI to optimize electronic devices and by incorporating novel materials and new techniques for securing DoW and commercial data and hardware. Beginning in FY 2026, efforts in this Project will be funded in PE 0602025E, Projects MQB-01 and MSL-02.