Project MT-15
$0.0MFY2027 request MIXED TECHNOLOGY INTEGRATION
FY2025 actual$53.4M
FY2026 enacted$0.0M
FY2027 request$0.0M
FY2027 Request
$0.0M
No FY2026 funding
FY2026 Enacted
$0.0M
▼ 100% vs FY2025
FY2025 Actual
$148.4M
Prior year
Roll-up of 2 projects. Projects are the summable leaves — the PE total is their sum, never added to it.
For fiscal year 2027, Defense-Wide agencies are requesting $0.0M for Advanced Electronics Technologies under RDT&E program element 0603739E, against nothing enacted in FY2026.
Funding trajectory
Funding profile, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure.
Actual Enacted Request Outyear (FYDP)
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 148.4 |
| FY2026 | Enacted | 0.0 |
| FY2027 | Request | 0.0 |
| FY2028 | Outyear | 0.0 |
| FY2029 | Outyear | 0.0 |
| FY2030 | Outyear | 0.0 |
| FY2031 | Outyear | 0.0 |
Where it sits
Acquisition lifecycle
This program is funded in RDT&E Budget Activity 3 — Advanced Technology Development.
Complete
Research
BA 1–2
Current
Advanced Technology
BA 3
Later
Prototyping
BA 4
Later
Development & Fielding
BA 5–7
Inside the program element
2 projects roll up into PE 0603739E
Projects are the summable leaves — the PE total is their sum, never added to it. Program elements and projects carry the full five-year plan; activities stop at the budget year.
Project MT-16
$0.0MFY2027 request BEYOND SCALING ADVANCED TECHNOLOGIES
FY2025 actual$95.0M
FY2026 enacted$0.0M
FY2027 request$0.0M
Program detail
Mission & acquisition strategy
The efforts described in this Program Element (PE) address the Advanced Technology Development associated with the Advanced Electronics Technologies Program that seeks to design and demonstrate state-of-the-art manufacturing and processing technologies for the production of various electronics and microelectronic devices, sensor systems, integrated photonic-electronic components that have military applications and potential commercial utility. Introduction of advanced product design capability and flexible, scalable manufacturing techniques will enable the commercial sector to rapidly and cost-effectively satisfy military requirements.
Project MT-15, MT-16 — MIXED TECHNOLOGY INTEGRATION
Ask Hitch
Ask this program element
Answers are generated from the figures on this page — the FY2027 justification exhibits and the marks tracked above — and nothing else is consulted. Confirm any figure against the cited exhibit before you use it externally.
H
Questions this page can answer
How does the FY2027 request compare with FY2026, and what does the five-year plan show?Which project inside PE 0603739E is growing fastest, and which is shrinking?In plain terms, what is this program element for and how is it being acquired?
This page carries the budget justification and the NDAA marks — nothing else. For what a contractor has actually been obligated, the ledger is at hitchintel.com/vendors; for live solicitations, hitchintel.com/opportunities. Both are member surfaces.
Provenance
Cite this page
Sources
FY2027 Office of the Secretary of Defense RDT&E Budget Justification · Exhibits R-2 / R-3 · PE 0603739E (President's Budget PB2027).
Suggested citation
HitchAI, "Advanced Electronics Technologies (PE 0603739E)," federal budget intelligence, PB2027 vintage. hitchintel.com/programs/0603739E
Machine access
FY2027 Request
$0.0M
No FY2026 funding
FY2026 Enacted
$0.0M
▼ 100% vs FY2025
FY2025 Actual
$53.4M
Prior year
MIXED TECHNOLOGY INTEGRATION — one RDT&E project inside PE 0603739E. Congressional marks are recorded on the program element, not on a project.
Project MT-15 — MIXED TECHNOLOGY INTEGRATION — requests $0.0M in FY2027.
Funding trajectory
Project MT-15 funding, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure. Projects carry the full five-year plan; the activities inside them stop at the budget year.
Actual Enacted Request Outyear (FYDP)
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 53.4 |
| FY2026 | Enacted | 0.0 |
| FY2027 | Request | 0.0 |
| FY2028 | Outyear | 0.0 |
| FY2029 | Outyear | 0.0 |
| FY2030 | Outyear | 0.0 |
| FY2031 | Outyear | 0.0 |
Inside the project
2 accomplishments / planned programs
The R-2A exhibit. Activities carry the prior, current and budget year only — no five-year plan — and they are descriptive: coverage is partial and they do not always add back to the project, so count them, never total them.
Modular Efficient Laser Technology (MELT)
FY2025 actual$17.4M
FY2026 enacted—
FY2027 request—
FY2025 accomplishments - Completed scalability and alignment risk reduction analysis. - Designed fully integrated laser tile with good beam quality. - Held panelized high energy laser (HEL) design review and delivered design review package to include details of panelized HEL, modeling, and simulation.
Box Kick
FY2025 actual$36.0M
FY2026 enacted—
FY2027 request—
FY2025 accomplishments - Conducted a kinematic test series. - Developed representative hardware and conduct a test series in a controlled environment. - Planned platform integration events.
Project detail
What project MT-15 buys
The Mixed Technology Integration project funds the advanced development and demonstration of selected basic and applied electronics research programs. Examples of technologies with funded development and demonstration activities include, but are not limited to: reducing the size, weight, and power (SWaP) of components for laser weapon systems that will protect airborne platforms from emerging surface-to-air missiles; integrated photonic-electronic components for positioning, navigation and timing in GPS-denied environments; flexible, software-defined cameras that enable real-time image analysis of complex scenes to provide more actionable information; and optical communications systems that rely on no moving parts enabling their use on SWaP-restricted platforms. Funding under this project is intended to advance transitioning novel technologies to use, providing advanced components compatible with mid-term and other future warfighting requirements. Beginning in FY 2026, efforts in this Project will be funded in PE 0603469E, Project AET-02 and PE 0603467E, Project DAT-01.
FY2027 Request
$0.0M
No FY2026 funding
FY2026 Enacted
$0.0M
▼ 100% vs FY2025
FY2025 Actual
$95.0M
Prior year
BEYOND SCALING ADVANCED TECHNOLOGIES — one RDT&E project inside PE 0603739E. Congressional marks are recorded on the program element, not on a project.
Project MT-16 — BEYOND SCALING ADVANCED TECHNOLOGIES — requests $0.0M in FY2027.
Funding trajectory
Project MT-16 funding, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure. Projects carry the full five-year plan; the activities inside them stop at the budget year.
Actual Enacted Request Outyear (FYDP)
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 95.0 |
| FY2026 | Enacted | 0.0 |
| FY2027 | Request | 0.0 |
| FY2028 | Outyear | 0.0 |
| FY2029 | Outyear | 0.0 |
| FY2030 | Outyear | 0.0 |
| FY2031 | Outyear | 0.0 |
Inside the project
2 accomplishments / planned programs
The R-2A exhibit. Activities carry the prior, current and budget year only — no five-year plan — and they are descriptive: coverage is partial and they do not always add back to the project, so count them, never total them.
Next Generation Microelectronics Manufacturing (NGMM)
FY2025 actual$82.5M
FY2026 enacted—
FY2027 request—
FY2025 accomplishments - Demonstrated baseline manufacturing execution system capabilities that manage process modules, equipment activities, data collection, statistical process control, scheduling for experiments, wafer processing, and resources. - Updated roadmap with revised assessment of technical and business capabilities. - Developed comprehensive security plan that addresses physical security measures, data protection, and data handling. - Completed procurement, installation, and qualification of key equipment, including process, reliability, test, and metrology tools to support 3DHI processes. - Completed design review of 3DHI process and test vehicles. - Demonstrated baseline 3DHI fabrication process…
Continuous-correctness On Opaque Processors (COOP)
FY2025 actual$12.5M
FY2026 enacted—
FY2027 request—
FY2025 accomplishments - Researched hardware/software approaches for creating unique software signatures. - Researched hardware/software approaches to detect and understand software signatures. - Developed proof-of-concept that software signatures can be controlled.
Project detail
What project MT-16 buys
The Beyond Scaling Advanced Technologies Project supports activities to enable and accelerate the transition of disruptive microelectronics advancement, including those developed under the Beyond Scaling Sciences (ES-02) and Beyond Scaling Technology (ELT-02) projects. Funding under this project will include developing new technologies and capabilities in commercial settings, establishing access to these new processes and to commercial state-of-the-art foundries, enabling prototyping, developing manufacturable processes for three-dimensional heterogeneous integration (including integrated photonics), advancing new architectures and integration technologies for advanced field programmable gate arrays (FPGAs), and innovating back end of line technologies for wide bandgap semiconductors. Beginning in FY 2026, efforts in this Project will be funded in PE 0603469E, Project AET-02.