Project 903
$25.8MFY2027 request ▼ 7%Access to Advanced Packaging and Testing - Demonstration
FY2025 actual$46.1M
FY2026 enacted$27.7M
FY2027 request$25.8M
Product Development
FY2027 Request
$51.2M
▼ 61% vs FY2026
FY2026 Enacted
$132.8M
▼ 8.8% vs FY2025
FY2025 Actual
$145.5M
Prior year
Roll-up of 3 projects. Projects are the summable leaves — the PE total is their sum, never added to it.
For fiscal year 2027, Defense-Wide agencies are requesting $51.2M for Trusted and Assured Microelectronics under RDT&E program element 0605294D8Z, down 61% from FY2026.
Funding trajectory
Funding profile, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure.
Actual Enacted Request Outyear (FYDP)
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 145.5 |
| FY2026 | Enacted | 132.8 |
| FY2027 | Request | 51.2 |
| FY2028 | Outyear | 55.9 |
| FY2029 | Outyear | 59.5 |
| FY2030 | Outyear | 62.0 |
| FY2031 | Outyear | 62.0 |
Where it sits
Acquisition lifecycle
This program is funded in RDT&E Budget Activity 5 — System Development & Demonstration.
Complete
Research
BA 1–2
Complete
Advanced Technology
BA 3
Complete
Prototyping
BA 4
Current
Development & Fielding
BA 5–7
Inside the program element
3 projects roll up into PE 0605294D8Z
Projects are the summable leaves — the PE total is their sum, never added to it. Program elements and projects carry the full five-year plan; activities stop at the budget year. This PE moves -61% overall, which can hide much larger swings below.
Project 905
$23.4MFY2027 request ▼ 4%DOW Unique NDS RADHARD - Demonstration
FY2025 actual$46.7M
FY2026 enacted$24.3M
FY2027 request$23.4M
Product Development
Project 902
$2.1MFY2027 request ▼ 97%Access to State-of-the-Art (SOTA) Microelectronics - Demonstration
FY2025 actual$52.7M
FY2026 enacted$80.7M
FY2027 request$2.1M
Product Development
The whole program
SOTA is funded on 2 lines across 1 appropriations
This page shows $2.1M of SOTA, 12% of the program's $16.9M FY2027 request. The rest is appropriated elsewhere.
| Also funded here | Type | Component | FY2027 $M |
|---|---|---|---|
| Access to State-of-the-Art (SOTA) Microelectronics - Development | RDT&E | Defense-Wide | 14.9 |
| SOTA total | Defense-Wide | 16.9 |
Lines whose title names the program. 6 further lines only mention SOTA in their justification text — those fund something else and are deliberately excluded from the total.
Congressional action
Congressional marks
Committee marks on the FY2027 request. Adds and cuts are reconciled in conference before they become law.
RequestPresident's Budget
$51.2M
House NDAA (HASC)HASC
$51.2M full · +$0
Senate NDAA (SASC)SASC
$151.2M +$100.0M · +195%
House Approps (HAC-D)HAC_D
$51.2M full · +$0
▲ $100.0M chamber gap — unresolved as of 2026-07-27. These are FY2027 authorization marks (NDAA); appropriations and the conference agreement may differ.
Who's building it
Where the FY2027 request goes
Performers named in the R-3 exhibit, resolved into industry, government-lab, and unspecified shares. Budget-justification contract funding, not obligations.
| Where FY2027 funding flows | Share | $M |
|---|---|---|
| Government labs & warfare centers | 100% | 51.2 |
| FY2027 request | 100% | 51.2 |
Program detail
Mission & acquisition strategy
This program provides microelectronics demonstration activities that enable warfighting systems and platforms to keep pace with commercial microelectronics technological advances, reduce reliance on obsolete microelectronics, and mitigate the Department’s reliance on sole source and offshore foundries for assured state-of-the-art (SOTA) microelectronics. It focuses on enduring access to a multiplicity of modern on shore manufacturing processes, leveraging commercial volumes to maintain long term viability and protects the intellectual property (IP) of the microelectronic parts that are manufactured.
N/A
Project 903, 905, 902 — Access to Advanced Packaging and Testing - Demonstration
- Product Development
Ask Hitch
Ask this program element
Answers are generated from the figures on this page — the FY2027 justification exhibits and the marks tracked above — and nothing else is consulted. Confirm any figure against the cited exhibit before you use it externally.
H
Questions this page can answer
How does the FY2027 request compare with FY2026, and what does the five-year plan show?What did the FY2027 NDAA committees do to this request?Which project inside PE 0605294D8Z is growing fastest, and which is shrinking?How is the FY2027 request split between industry and government performers?
This page carries the budget justification and the NDAA marks — nothing else. For what a contractor has actually been obligated, the ledger is at hitchintel.com/vendors; for live solicitations, hitchintel.com/opportunities. Both are member surfaces.
Provenance
Cite this page
Sources
FY2027 Office of the Secretary of Defense RDT&E Budget Justification · Exhibits R-2 / R-3 · PE 0605294D8Z (President's Budget PB2027) — and FY2027 NDAA committee marks, as tracked 2026-07-27.
Suggested citation
HitchAI, "Trusted and Assured Microelectronics (PE 0605294D8Z)," federal budget intelligence, PB2027 vintage. hitchintel.com/programs/0605294D8Z
Machine access
Markdown twin
/programs/0605294D8Z.md · MCP mcp.hitchintel.com → budget_get_program_element, budget_get_cong_marksFY2027 Request
$25.8M
▼ 7.0% vs FY2026
FY2026 Enacted
$27.7M
▼ 40% vs FY2025
FY2025 Actual
$46.1M
Prior year
Access to Advanced Packaging and Testing - Demonstration — one RDT&E project inside PE 0605294D8Z. Congressional marks are recorded on the program element, not on a project.
Project 903 — Access to Advanced Packaging and Testing - Demonstration — requests $25.8M in FY2027, 50% of the $51.2M requested for program element 0605294D8Z. Year over year it falls 7.0% against FY2026.
Funding trajectory
Project 903 funding, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure. Projects carry the full five-year plan; the activities inside them stop at the budget year.
Actual Enacted Request Outyear (FYDP)
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 46.1 |
| FY2026 | Enacted | 27.7 |
| FY2027 | Request | 25.8 |
| FY2028 | Outyear | 26.5 |
| FY2029 | Outyear | 27.0 |
| FY2030 | Outyear | 27.5 |
| FY2031 | Outyear | 27.5 |
Inside the project
1 accomplishment / planned program
The R-2A exhibit. Activities carry the prior, current and budget year only — no five-year plan — and they are descriptive: coverage is partial and they do not always add back to the project, so count them, never total them. Opening lines only here — the full year-by-year narrative is on the project page.
FY2025 actual$46.1M
FY2026 enacted$27.7M
FY2027 request$25.8M
• Adaptive Compute Acceleration Platform Chiplet (“ACAP”) will complete productization in 1Q FY 2027. • Performance Optimization with Wideband Enhanced Radio-Frequency Unified Package (“POWER-UP”) Multi-Chip Package (MCP) integrating gallium nitride (GaN) high-power amplifiers (HPA), GaN low-noise amplifiers (LNA), and a silicon…
Read the FY2027 plan →Project detail
What project 903 buys
Advanced packaging provides essential performance improvements, size, weight, power, and cost (SWAP-C) benefits, and unique opportunities to disaggregate DoW requirements into smaller and lower cost chiplets while maximally leveraging state-of-the-art (SOTA) commercial technologies. However domestic advanced packaging capabilities are limited and the heterogeneously integrated (HI) chiplet ecosystem is nascent. This project is a collaborative effort among the DoW, Defense Industrial Base (DIB), and domestic commercial industry to expand existing capabilities to demonstrate advanced packaging and test solutions that meet DoW needs.
R-3 lines of work
- Product Development
FY2027 Request
$23.4M
▼ 4.0% vs FY2026
FY2026 Enacted
$24.3M
▼ 48% vs FY2025
FY2025 Actual
$46.7M
Prior year
DOW Unique NDS RADHARD - Demonstration — one RDT&E project inside PE 0605294D8Z. Congressional marks are recorded on the program element, not on a project.
Project 905 — DOW Unique NDS RADHARD - Demonstration — requests $23.4M in FY2027, 46% of the $51.2M requested for program element 0605294D8Z. Year over year it falls 4.0% against FY2026.
Funding trajectory
Project 905 funding, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure. Projects carry the full five-year plan; the activities inside them stop at the budget year.
Actual Enacted Request Outyear (FYDP)
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 46.7 |
| FY2026 | Enacted | 24.3 |
| FY2027 | Request | 23.4 |
| FY2028 | Outyear | 27.5 |
| FY2029 | Outyear | 28.1 |
| FY2030 | Outyear | 28.8 |
| FY2031 | Outyear | 28.8 |
Inside the project
1 accomplishment / planned program
The R-2A exhibit. Activities carry the prior, current and budget year only — no five-year plan — and they are descriptive: coverage is partial and they do not always add back to the project, so count them, never total them. Opening lines only here — the full year-by-year narrative is on the project page.
FY2025 actual$46.7M
FY2026 enacted$24.3M
FY2027 request$23.4M
• Demonstrate developed technologies for tactical datalink applications, including developments in optical communications, GaN technology, and multi-chip packaging advancements to improve the data rate and link range in representative environments, and accelerate transition to the warfighter. • Demonstrate and validate the manufacturing…
Read the FY2027 plan →Project detail
What project 905 buys
The DoW relies on a small number of specialty suppliers to develop and acquire the application specific integrated circuits (ASICs) and specialized or modified commercial components required to satisfy military needs for radiation hardened digital and analog microelectronics. By partnering in the demonstration of SOTA material sources, foundries, and packaging facilities, the DoW is aligning commercial practices with unique needs for performance and functionality, and encouraging open access design to stimulate innovation and drive affordability. Expanding the manufacturing capability and capacity of facilities for fabrication, packaging, and testing are all enablers to ensuring availability of radiation hardened microelectronics.
R-3 lines of work
- Product Development
FY2027 Request
$2.1M
▼ 97% vs FY2026
FY2026 Enacted
$80.7M
▲ 53% vs FY2025
FY2025 Actual
$52.7M
Prior year
Access to State-of-the-Art (SOTA) Microelectronics - Demonstration — one RDT&E project inside PE 0605294D8Z. Congressional marks are recorded on the program element, not on a project.
Project 902 — Access to State-of-the-Art (SOTA) Microelectronics - Demonstration — requests $2.1M in FY2027, 4.0% of the $51.2M requested for program element 0605294D8Z. Year over year it falls 97% against FY2026.
Funding trajectory
Project 902 funding, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure. Projects carry the full five-year plan; the activities inside them stop at the budget year.
Actual Enacted Request Outyear (FYDP)
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 52.7 |
| FY2026 | Enacted | 80.7 |
| FY2027 | Request | 2.1 |
| FY2028 | Outyear | 1.9 |
| FY2029 | Outyear | 4.4 |
| FY2030 | Outyear | 5.7 |
| FY2031 | Outyear | 5.7 |
Inside the project
1 accomplishment / planned program
The R-2A exhibit. Activities carry the prior, current and budget year only — no five-year plan — and they are descriptive: coverage is partial and they do not always add back to the project, so count them, never total them. Opening lines only here — the full year-by-year narrative is on the project page.
Access to State-of-the-Art (SOTA) Microelectronics - Demonstration▼ 97%
FY2025 actual$52.7M
FY2026 enacted$80.7M
FY2027 request$2.1M
Demonstrate, test and evaluate program-targeted chips in concert with transition partners. These efforts include application specific integrated circuits (ASICs) for communications and imaging applications.
Project detail
What project 902 buys
This project establishes multiple strategic partnerships with existing commercial state-of-the-art (SOTA) domestic foundries to develop a data-driven, evidence-based approach to supply chain protection and demonstrate the assured manufacture of advanced electronic components. It enables the DoW to leverage the rapid advancements in microelectronics technology while maintaining trust and assurance in microelectronics with on shore advanced fabrication capabilities. Successful implementations will transition SOTA technologies into DoW systems and platforms, enable access to multiple on shore commercial microelectronics facilities, establish secure design capabilities, and implement a data-driven evidence-based approach to supply chain protection. Additionally, this project drives collaboration with industry to apply evidence-based assurance methodologies.
R-3 lines of work
- Product Development