What project 903 buys
Advanced packaging provides essential performance improvements, size, weight, power, and cost (SWAP-C) benefits, and unique opportunities to disaggregate DoW requirements into smaller and lower cost chiplets while maximally leveraging state-of-the-art (SOTA) commercial technologies. However domestic advanced packaging capabilities are limited and the heterogeneously integrated (HI) chiplet ecosystem is nascent. This project is a collaborative effort among the DoW, Defense Industrial Base (DIB), and domestic commercial industry to expand existing capabilities to demonstrate advanced packaging and test solutions that meet DoW needs.
- Product Development
Project 903 funding, FY2025–FY2031
Prior years are actuals, the budget year is the request, and the outyears are the FYDP plan. Estimate types are colored and never summed into one figure. Projects carry the full five-year plan; the activities inside them stop at the budget year.
| Fiscal Year | Estimate Type | Amount ($M) |
|---|---|---|
| FY2025 | Actual | 46.1 |
| FY2026 | Enacted | 27.7 |
| FY2027 | Request | 25.8 |
| FY2028 | Outyear | 26.5 |
| FY2029 | Outyear | 27.0 |
| FY2030 | Outyear | 27.5 |
| FY2031 | Outyear | 27.5 |
1 accomplishment / planned program
The R-2A exhibit — the only level of the budget that describes work that has not happened yet. Activities carry the prior, current and budget year only, no five-year plan. Each describes FY2027 work in enough detail to have its own page; the rest are shown here in full. Coverage is partial across the corpus, so count activities, never total them.
• Adaptive Compute Acceleration Platform Chiplet (“ACAP”) will complete productization in 1Q FY 2027. • Performance Optimization with Wideband Enhanced Radio-Frequency Unified Package (“POWER-UP”) Multi-Chip Package (MCP) integrating gallium nitride (GaN) high-power amplifiers (HPA), GaN low-noise amplifiers (LNA), and a silicon…
Read the FY2027 plan →