Advanced Surface Machinery Sys

The Guided Missile Battleship (BBG(X)) program supports the expansion and modernization of the Nation's large surface combatant fleet, reinforcing maritime dominance. The Battleship is based on the validated requirement for high-end surface capability directly supporting the Navy Warfighting Concept (NWC) and Expanded Maritime Maneuver (EMM) that cannot be met by current fleet assets. Adding capability at the highest end of the Golden Fleet high-low mix, the Battleship's primary role is to deliver high-volume, long-range offensive fires and serve as a robust, survivable forward command and control platform. The expanded size and energy density of the new Battleship provide critical advantages for future naval warfare, offering a future-proof platform with distinct capabilities that enhance deterrence. Its advanced systems will enable true long-range strike with hypersonic weapons housed in new, larger vertical launch systems. Vastly increased power generation, managed by a sophisticated integrated power system with high-capacity energy storage, will support mission-critical directed energy weapons like high-output lasers and electromagnetic railguns, reducing reliance on costly single-use munitions. Furthermore, its advanced naval gunfire offers cost-effective options for strike and defense, and its capacity to embark a fleet command staff enhances survivability by putting commanders closer to the fight. As a flexible command-and-control platform for both manned and unmanned platforms, the Battleship can lead a Surface Action Group, integrate with a Carrier Strike Group, or operate autonomously to secure critical sea lanes. To overcome the capacity limits of the Arleigh Burke-class destroyer and the capability compromises of the planned DDG(X), the Battleship is designed specifically to accommodate these advanced weapon systems. The ship's architecture provides the foundational space, weight, power, and cooling for five large weapon stations, enabling the integration of large-format missile launchers, railguns, and high-energy lasers that cannot be incorporated within legacy platforms. The design ensures room for future technological advancements and sends an unmistakable signal of American resolve, inspiring confidence in allies and fear in adversaries.

This Project Unit includes the development and risk reduction of advanced surface ship Hull, Mechanical, and Electrical (HM&E) components and systems, power and energy systems, and for all future ships and back-fit ships where appropriate HM&E cyber security. Specific sub-projects include: Prior to FY 2026, the DDG(X) power and propulsion risk mitigation demonstration sub-project was used to de-risk the DDG(X) Integrated Power System (IPS) and satisfy the FY 2020 National Defense Authorization Act (NDAA) Section 131 requirements for land based testing of propulsion systems in a realistic environment and FY 2022 NDAA Section 221 requirement for a land based test program for the engineering plant prior to DDG(X) construction start. The DDG(X) hardware development and procurement and land-based testing efforts executed under this PE were informed by DDG(X) Ship Design specifications developed under PE 0603564N / PU 0411. In FY 2026, the DDG(X) efforts are being modified to meet the BBG(X) requirements and will be reflected in FY 2027 under PU 2486. Naval Power and Energy Systems developments and transitions including power generation, power conversion, power distribution, energy storage, power utilization and automation and control functions for fully integrated electric propulsion (such as T-AKE -1 class or DDG 1000 class), hybrid electric propulsion (such as LHD 8 and LHA(R) class), as well as legacy mechanical propulsion ships (such as DDG 51 class). Naval Power and Energy Systems sub-project supports optimized integration of naval warship power and energy systems to support Directed Energy (DE) and other high powered mission systems, ship power quality requirements including frequency and voltage control for AC systems, DE and other high powered mission systems, appropriate component and system controls, integration of components and systems into future and current ships, and providing power and energy system solution alternatives to new and existing platforms. Existing ships' power systems require optimized integration via energy storage and advanced controls techniques to withstand the effects of DE and other high powered mission systems and avoid negative impacts to power generating equipment (diesel/gas turbine generators).

C332 Silicon Carbide Power Electronics & System Integration: The proposed effort is to develop a prototype demonstrator of a SiC-enabled hybrid modular multilevel converter (HMMC-SiC) that is targeted for high power and medium voltage power system applications in particular for ship propulsion and ship integrated power systems. The development will focus on generating key sub-assemblies such as the full-bridge submodules (SMs) with SiC MOSFETs (SMs-SiC) and SMs with silicon IGBTs (SMs-Si) with a focus on SMs-SiC, and the medium voltage IGBT semiconductor switches (MVSS) assemblies. These building block assemblies (SMs and MVSS) include the semiconductors and their peripherals such as gate drivers, power supplies, protection, capacitors etc. Further we will integrate these elements into a working and demonstratable system in commercial or custom packaging with dedicated hardware such as the arm inductors, bus work, controllers etc. This will mature and elevate the technology readiness level (TRL) propose this converter topology for near- and mid-term US Navy ship propulsion and power system applications. CA21 Silicon Carbide Semiconductors: The focus of this project is the design, development, and testing of silicon carbide (SiC) semiconductor devices. The primary objectives are to achieve a reduction in the physical size of the components and an increase in their switching frequency capabilities. This involves leveraging the superior material properties of SiC, such as its higher breakdown voltage and thermal conductivity, which allow for more compact and efficient power electronic systems. The faster switching speeds of SiC transistors lead to smaller passive components, further reducing the total size of the drive/converter. The design and testing process will validate the performance and reliability of these next-generation SiC devices for high-power applications. CA22 Integrated Silicon Carbine Bi-Directional Power Converter: This advanced technology provides wide-bandgap properties which enable power conversion systems with higher power density, allowing for reduced size and weight while delivering higher efficiency.